Complete Solution for IC Package Design

IC Packaging Design & Verification

Monolithic scaling limitations are driving the growth of 2.5/3D multi-die heterogeneous and homogeneous integrated technologies allowing PPA targets to be met. Our integrated flow addresses the challenges of prototyping to Signoff for FOWLP, 2.5/3D IC, and other emerging technologies.

IC Packaging Design & Verification Resource Library

Visit the IC Packaging resource library to view on-demand webinars and
demonstrations, downloads white papers and fact sheets, and access viewers.