IC Packaging Design & Verification

Complete Solution for IC Package Design

Prototyping to Signoff for FOWLP, 2.5/3D IC and More

Monolithic scaling limitations are driving the growth of 2.5/3D multi-die heterogeneous and homogeneous integrated technologies that allow PPA targets to be met. The Siemens Digital Industries Software comprehensive integrated flow addresses the challenges of these emerging technologies.

IC Packaging Design & Verification Resource Library

Visit the IC Packaging resource library to view on-demand webinars and
demonstrations, downloads white papers and fact sheets, and access viewers.