Drive for Emerging Technologies

To minimize layer count and keep package and PCB costs low without impacting the cost of the device, ICs, substrates, and PCBs must be optimized within the context of each other.

A complete solution for physical implementation of High Density Advanced Packages (HDAP), such as FOWLP, 2.5/3D, and SiP technologies.

Comprehensive analysis of die/interposer/package coupling, signal integrity/PDN performance, and thermal analysis.

The Xpedition HDAP flow offers complete design verification of stacked die assemblies, such as stacked memories, stacked sensor arrays, interposer-based structures, and fan-out wafer-level packaging.

Heterogeneous and homogeneous 2.5/3D system connectivity IC package planning and prototyping for evaluating different IC, interposer, package, and PCB integration scenarios.

Provides a complete physical design solution, including flip chip and/or wirebond attach, stacked die, heterogeneous integration, and multi-device System-In-Package (SiP) or modules.

Complete design verification of stacked die assemblies, such as stacked memories, stacked sensor arrays, interposer-based structures, and fan-out wafer-level packaging.