{"showBreadcrumbs":true,"breadcrumbs":[{"title":"Siemens EDA Software","path":"/en-US/"},{"title":"IC Packaging","path":""}],"title":"IC Packaging Design & Verification","image":"//images.ctfassets.net/17si5cpawjzf/4Pw4OgpdNNpoQ6oE4B6MIz/e2229f13b1faef94d1404c4fb70d332f/icpackaging-is1212650333-hero-1280x720.jpg?w=1920&q=60","image_alt":"ic packaging, an image of a chip in the center of a computer motherboard","secondaryButton":{"text":"Find Products","url":"/en-US/ic-packaging/software/"},"rotatingText":[],"overlay":true,"height":400,"description":"<p>Complete Solution for IC Package Design</p>"}
IC Packaging Design & Verification
<p>Complete Solution for IC Package Design</p>

Drive for Emerging Technologies

Cost, risk, and monolithic scaling limitations drive the growth of multi-die heterogeneous and homogeneous advanced IC packaging solutions. By bringing the traditional IC and IC package design worlds together, a comprehensive HDAP flow meets the unique challenges of HDAP design and verification.

Explore IC Packaging & Verification Challenges

Today's high-performance products demand advanced IC packaging. These products require heterogeneous silicon (chiplets) to be integrated into multi-chip, wafer-based HDAP packages, such as FOWLP, 2.5/3DIC, SiP, and CoWoS. These packages must be optimized for the target system’s PCB(s).

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