IC Packaging Design & Verification

Complete Solution for IC Package Design

Drive for Emerging Technologies

Cost, risk, and monolithic scaling limitations drive the growth of multi-die heterogeneous and homogeneous advanced IC packaging solutions. By bringing the traditional IC and IC package design worlds together, a comprehensive HDAP flow meets the unique challenges of HDAP design and verification.

IC Packaging Design & Verification Resource Library

Visit the IC Packaging resource library to view on-demand webinars and
demonstrations, downloads white papers and fact sheets, and access viewers.