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Close up of a computer chip.

Semiconductor packaging best practices​

IC package designer productivity and efficiency​

IC packaging automationand intelligent design-IPreplication helps designersmeet design performanceand quality targets, anddesign schedules.

Leveraging 3D design for IC packaging efficiency​

Multi chiplet/ASIC packages often use substrates for high-speed integration and ball grid arrays (BGA) for connection, including mechanical stiffeners andheat spreaders. The IC package can look like a Manhattan skyline. The ability to visualize/edit in 3D reduces errors and shrinks design cycles.


2D and 3D delivers productivity and efficiency​

Designers can view and edit their IC package designs simultaneously in 2D and 3D

Designer productivity and efficiency​ resources

Learn more about IC package designer productivity and efficiency capabilities and benefits​