The pace of innovation in electronics is constantly accelerating. To enable our customers to deliver life-changing innovations to the world faster and to become market leaders, we are committed to delivering the world’s most comprehensive portfolio of electronic design automation (EDA) software, hardware, and services.
Efficiently create the world’s most advanced integrated circuits (ICs)
Create ICs with the optimal balance of power, performance, area, and functionality
Verify at all levels - from C++ prototype to silicon test to digital twin
Meet security, functional safety, and silicon lifecycle requirements
Deliver coverage, signoff, and higher yield faster with AI-powered EDA tools
Leverage a complete High Density Advanced Package (HDAP) solution
Develop 3D package assembly models using early prototyping and planning
Perform physical design, verification, modeling, and signoff faster
Deliver tomorrow’s semiconductor integration innovations today
Scale seamlessly from single PCB to systems design, from individual to enterprise
Integrate and optimize entire digital processes from spec to manufacturing
Deploy advanced model-based systems engineering methodologies
Achieve higher productivity and efficiency regardless of product complexity
Leverage digital prototypes for higher performance and manufacturability
Our EDA Services organization has a long history of success helping our customers maximize business impact and technical value from Siemens EDA products. Delivered by a global team of technology and methodology experts, our award-winning services are underpinned by decades of real-world design, production, and manufacturing experience.
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Efficiently create the world’s most advanced integrated circuits (ICs)
Create ICs with the optimal balance of power, performance, area, and functionality
Verify at all levels - from C++ prototype to silicon test to digital twin
Meet security, functional safety, and silicon lifecycle requirements
Deliver coverage, signoff, and higher yield faster with AI-powered EDA tools
Leverage a complete High Density Advanced Package (HDAP) solution
Develop 3D package assembly models using early prototyping and planning
Perform physical design, verification, modeling, and signoff faster
Deliver tomorrow’s semiconductor integration innovations today
Scale seamlessly from single PCB to systems design, from individual to enterprise
Integrate and optimize entire digital processes from spec to manufacturing
Deploy advanced model-based systems engineering methodologies
Achieve higher productivity and efficiency regardless of product complexity
Leverage digital prototypes for higher performance and manufacturability
Our EDA Services organization has a long history of success helping our customers maximize business impact and technical value from Siemens EDA products. Delivered by a global team of technology and methodology experts, our award-winning services are underpinned by decades of real-world design, production, and manufacturing experience.