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IC design, verification & manufacturing

Siemens EDA is a leader in IC design, verification, and manufacturing. Our tools enable customers to design the innovative ICs that drive digitalization worldwide, proliferating high-speed wired and 5G communications, cloud computing, autonomous driving, and AI-smarter everything.

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Tessent Multi-die solution automates 2.5D & 3D IC DFT

The new the Tessent™ Multi-die software solution helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.





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Siemens & UMC develop 3D IC hybrid bonding workflow

The companies will collaboratively develop and implement a new multi-chip 3D IC planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.

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Questa Verification IP support for CXL 3.0 protocol

The Questa Verification IP solution now supports the new Compute Express Link (CXL) 3.0 protocol for high-performance computing (HPC) applications.

Featured products

Verification of SoC designs
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Veloce Hardware Platform

The Veloce Strato Platform is engineered to scale to support 15 BG designs, capable of verifying the largest chips ever designed while helping to meet your performance and power requirements.

Integrated Photonics Design
Test and Silicon Lifecycle
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Tessent Silicon Lifecycle Solutions

Solutions for IC test, operations, and functional monitoring to ensure the highest test coverage, accelerated yield ramp, and to improve quality and reliability across the silicon lifecycle.

Physical Verification Tools
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Calibre Design Solutions

Calibre Design Solutions delivers a complete IC verification and DFM optimization platform that speeds designs from creation to manufacturing, addressing all sign-off requirements.