Siemens EDA is a leader in IC design, verification, and manufacturing. Our tools enable customers to design the innovative ICs that drive digitalization worldwide, proliferating high-speed wired and 5G communications, cloud computing, autonomous driving, and AI-smarter everything.
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The new the Tessent™ Multi-die software solution helps customers dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures.
The companies will collaboratively develop and implement a new multi-chip 3D IC planning, assembly validation and parasitic extraction (PEX) workflow for UMC’s wafer-on-wafer and chip-on-wafer technologies.
The Questa Verification IP solution now supports the new Compute Express Link (CXL) 3.0 protocol for high-performance computing (HPC) applications.
The Veloce Strato Platform is engineered to scale to support 15 BG designs, capable of verifying the largest chips ever designed while helping to meet your performance and power requirements.
Solutions for IC test, operations, and functional monitoring to ensure the highest test coverage, accelerated yield ramp, and to improve quality and reliability across the silicon lifecycle.
Calibre Design Solutions delivers a complete IC verification and DFM optimization platform that speeds designs from creation to manufacturing, addressing all sign-off requirements.