Siemens EDA PCB Forums Europe will demonstrate how Siemens enables electronic engineering teams to overcome today’s challenges of product, process, organization, and supply chain complexity with the latest innovations in Xpedition, Hyperlynx, and Valor technologies.
In this success story, you’ll discover how TESAT, a market leader in telecommunication payloads for satellites and a technology leader in laser communications, utilizes Siemens’ Xpedition collaborative flow to launch high-density space designs better and faster.
The Siemens portfolio enables the digital transformation of electronic systems design. See how it is best positioned to deliver digitally integrated product ideation platforms for the next market-winning products.
Looking for companies that can design or fabricate boards for you? Consult one of the following Service Bureaus.