The Digital Transformation of Electronic Systems

{"headingSize":"heading2","sectionHeading":"Reduce Risk in Electronic Systems Design","sectionDescription":"<p>Product, organizational, and process complexity of electronic systems design risks budget overruns, missed schedules, and design errors. Companies must adopt a <a target=\"_blank\" rel=\"noopener noreferrer\" href=https://www.plm.automation.siemens.com/global/en/our-story/glossary/digital-transformation/25207>digital transformation strategy</a> that addresses inefficiencies and optimizes multi-domain systems design, verification, and manufacturing.</p>","align":"text-left","parentCard":{"cardTitle":"Electronic Systems Complexity","cardDescription":"Digital transformation is driven by the urgent need for electronic systems design companies to overcome increasing complexity and meet shrinking design and production schedules.","imgUrl":"https://images.sw.siemens-cdn.com/siemens-disw-assets/public/1vPcFe0VeM5pVRHVcZauoR/en-US/Scaleability-640x360.jpg?w=640&q=60","ctaText":"Learn More","parentCardLink":"/en-US/pcb/mitigating-risk","childCards":[{"cardTitle":"Product Complexity","cardDescription":"Advanced nodes, faster DDR, SerDes, multi-board systems, and reduced electronic form factors increase product complexity.","cardLink":"/en-US/pcb/mitigating-risk/product-complexity"},{"cardTitle":"Organizational Complexity ","cardDescription":"Large teams, increasing specialization, and dispersed groups developing a single product heighten organizational complexity. ","cardLink":"/en-US/pcb/mitigating-risk/organizational-complexity"},{"cardTitle":"Process Complexity","cardDescription":"Parallel electronics, mechanical, software, and manufacturing domains complicate processes throughout the development flow.","cardLink":"/en-US/pcb/mitigating-risk/process-complexity"}]},"childCards":[{"cardTitle":"Product Complexity","cardDescription":"Advanced nodes, faster DDR, SerDes, multi-board systems, and reduced electronic form factors increase product complexity.","cardLink":"/en-US/pcb/mitigating-risk/product-complexity"},{"cardTitle":"Organizational Complexity ","cardDescription":"Large teams, increasing specialization, and dispersed groups developing a single product heighten organizational complexity. ","cardLink":"/en-US/pcb/mitigating-risk/organizational-complexity"},{"cardTitle":"Process Complexity","cardDescription":"Parallel electronics, mechanical, software, and manufacturing domains complicate processes throughout the development flow.","cardLink":"/en-US/pcb/mitigating-risk/process-complexity"}]}

{"headingSize":"heading2","sectionHeading":"Address Critical Engineering Challenges","sectionDescription":"<p>Dealing with increasing systems complexity requires a complete PCB systems design flow covering multi-board definition, design capture, high-density advanced packaging, electro-mechanical co-design, physical layout, verification, and streamlined hand-off to manufacturing.</p>","align":"text-left","parentCard":{"cardTitle":"A Digital Strategy","cardDescription":"To achieve a digital transformation, the following must be enabled: multi-discipline systems engineering, concurrent design, process automation, design data integrity, and design verification.","imgUrl":"https://images.sw.siemens-cdn.com/siemens-disw-assets/public/7ECqe0xwxKZYS36r5rIDqc/en-US/Layout_EBSD_PCB_Assembly_106.jpg?w=640&q=60","ctaText":"Learn More","parentCardLink":"/en-US/pcb/critical-engineering-challenges","childCards":[{"cardTitle":"Multi-Discipline Systems Engineering","cardDescription":"Xpedition delivers integration, collaboration, and co-design systems between IC packaging, multi-board, RF, harness, FPGA, and MCAD.","cardLink":"/en-US/pcb/critical-engineering-challenges/multi-discipline","linkData":"{\"name\":\"ECAD-MCAD-640x360\",\"id\":\"1zXeSaOlnoxZ5v4qeXVMiC\",\"contentType\":\"image/jpeg\"}"},{"cardTitle":"Concurrent Design","cardDescription":"Electronic design companies are continually faced with getting products to market faster with reduced costs. To be a first-to-market company you need collaboration and co-design systems.","cardLink":"/en-US/pcb/critical-engineering-challenges/concurrent-design"},{"cardTitle":"Process Automation ","cardDescription":"Lowering electronic product development costs and meeting delivery dates are the top challenges faced by best-in-class companies. Meeting these challenges requires design flow automation.","cardLink":"/en-US/pcb/critical-engineering-challenges/process-automation"},{"cardTitle":"Design Data Integrity ","cardDescription":"Engineering teams face challenges associated with the creation, reliability and management of design data throughout product design. To succeed you need to leverage and manage library and design data.","cardLink":"/en-US/pcb/critical-engineering-challenges/design-data-integrity","linkData":"{\"name\":\"Optimize engineering data management 640x480\",\"id\":\"59q0umO6pEbKyIhSavgzjt\",\"contentType\":\"image/jpeg\"}"},{"cardTitle":"Design Verification","cardDescription":"The pressure to get electronics products to market quickly. You need to shift verification technologies earlier in the process to enable you to deliver products \"right to market, first time.\"","cardLink":"/en-US/pcb/critical-engineering-challenges/design-verification"}]},"childCards":[{"cardTitle":"Multi-Discipline Systems Engineering","cardDescription":"Xpedition delivers integration, collaboration, and co-design systems between IC packaging, multi-board, RF, harness, FPGA, and MCAD.","cardLink":"/en-US/pcb/critical-engineering-challenges/multi-discipline","linkData":"{\"name\":\"ECAD-MCAD-640x360\",\"id\":\"1zXeSaOlnoxZ5v4qeXVMiC\",\"contentType\":\"image/jpeg\"}"},{"cardTitle":"Concurrent Design","cardDescription":"Electronic design companies are continually faced with getting products to market faster with reduced costs. To be a first-to-market company you need collaboration and co-design systems.","cardLink":"/en-US/pcb/critical-engineering-challenges/concurrent-design"},{"cardTitle":"Process Automation ","cardDescription":"Lowering electronic product development costs and meeting delivery dates are the top challenges faced by best-in-class companies. Meeting these challenges requires design flow automation.","cardLink":"/en-US/pcb/critical-engineering-challenges/process-automation"},{"cardTitle":"Design Data Integrity ","cardDescription":"Engineering teams face challenges associated with the creation, reliability and management of design data throughout product design. To succeed you need to leverage and manage library and design data.","cardLink":"/en-US/pcb/critical-engineering-challenges/design-data-integrity","linkData":"{\"name\":\"Optimize engineering data management 640x480\",\"id\":\"59q0umO6pEbKyIhSavgzjt\",\"contentType\":\"image/jpeg\"}"},{"cardTitle":"Design Verification","cardDescription":"The pressure to get electronics products to market quickly. You need to shift verification technologies earlier in the process to enable you to deliver products \"right to market, first time.\"","cardLink":"/en-US/pcb/critical-engineering-challenges/design-verification"}]}