Digitally Integrated and Optimized

A digitally integrated environment enables efficient, secure, concurrent design across all engineering teams and with the broader supply chain. It enables teams to optimize the costs associated with a project, accelerate design time, manage data integrity and improve the quality of results.

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Digitally Transforming Engineering

Solutions to Digitally Integrate Teams

Product, process and organizational complexities conspire to create siloed, distributed teams, with inefficient hand-offs. Siemens solutions integrate across the electronics design flow and between engineering disciplines with a digital thread that minimizes rework and reduces time to market.

Multi-Board System Design

The Xpedition multi-board systems design flow is a fully-parallel, collaborative design environment where global teams can work on the same design in real-time.

ECAD/MCAD Co-Design

Collaborate efficiently between ECAD and MCAD domains to optimize electronics within tight form-factor constraints while still meeting quality, reliability and performance requirements.

Design Data Management

Leverage an integrated PCB design data management infrastructure, from initial system definition through the design process, to release, to manufacturing.

Design for Manufacturing

Integrated Valor DFM technology can identify manufacturing violations and optimization opportunities within your PCB design without leaving Xpedition.

Screenshot of Xpedition Enterpris concurrency

Concurrent Design

Xpedition supports multi-user, multi-site tool, and flow-based concurrent engineering throughout the product development process, dramatically reducing design cycles and improving product quality.

IC Packaging Design & Verification

Our integrated flow addresses the challenges of prototyping to Signoff for FOWLP, 2.5/3D IC, and other emerging technologies.