Close up of a computer chip.

Semiconductor packaging best practices​

IC packaging design capacity support and performance

As multi-chiplet/ASIC designs scale into multi-million pin assemblies, it is crucial that the IC packaging tools can handle this capacity while still delivering productivity and usability.

Efficient million pin plus IC packaging design support

Today's multi chiplet/ASIC packages typically use substrates for high-speed integration and package BGAs for connection to the PCB. This assembly often exceeds a million or more total pins. It is crucial that your IC packaging tools can handle the capacity and deliver productivity and usability.


Support for capacity and performance​

Xpedition Substrate Integrator and Xpedition Package Designer have been architected to deliver productivity performance on million pin plus designs​.


IC packaging design capacity support and performance​

Learn more about IC packaging designer productivity and efficiency capabilities and benefits.