Today's multi chiplet/ASIC packages typically use substrates for high-speed integration and package BGAs for connection to the PCB. This assembly often exceeds a million or more total pins. It is crucial that your IC packaging tools can handle the capacity and deliver productivity and usability.
Xpedition Substrate Integrator and Xpedition Package Designer have been architected to deliver productivity performance on million pin plus designs.
Learn more about IC packaging designer productivity and efficiency capabilities and benefits.