Explore and deliver product differentiation faster using 3D heterogeneous integration of node and performance-optimized chiplets with Siemens EDA's market-leading 3D IC technology solution.
Engineer a smarter future with a proven, complete 3D IC design flow from 3D architecture partitioning to planning, layout, design-for-test, thermal management, multi-die verification, interconnect IP, manufacturing signoff, and post-silicon lifecycle monitoring. Transform existing design and IP architectures into chiplets or build scalable 3D IC technology for faster TTM.
Tackle 3D IC integration and packaging with system co-optimization to balance requirements and resources and gain visibility into downstream impact to PPA and cost.
Enable digital transformation for 3D chip design with co-design, co-simulation and automated system analysis and checking. Replace manual interfaces and data exchanges with automated methods and defined workflows.
Comprehensive 3D IC packaging coverage for performance validation and design verification from predictive to final sign off. Automated reviews identify overt issues earlier in the chip design process and eliminate iterations.
Support team-based design for concurrent development and enable IP reuse and managed blocks. Leverage one chiplet layout tool for organic and silicon substrates for better advanced packaging design.
3D IC Design Flow is a comprehensive set of tools and workflows targeted to develop advanced 2.5/3D IC heterogeneous System-In-Package (SIP) designs.
Listen to industry experts discuss 3D IC concepts and the latest trends: chiplet designs, IC packaging, multi-die verification, golden netlists, electrical signoff, system analysis and more!
View the 3D IC resource library for white papers, webinars, articles and more on proposed chiplet standardization, system-level netlists and verification, and advanced packaging.