Tessent Multi-die software

Next-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) so that they behave as a single device. Tessent Multi-die delivers comprehensive automation for the highly complex DFT tasks associated with these 2.5D and 3D IC designs.

Key features

  • Dramatically speeds and simplifies critical DFT planning and implementation tasks for next-generation ICs based on 2.5D and 3D architectures
  • Enables the rapid generation of IEEE 1838 compliant hardware for 3D IC architectures
  • Extracts a single Boundary Scan Description Language (BSDL) for package level and generates patterns
  • Extracts die-to-die BSDL and generates boundary-scan based inter-die patterns
  • Supports IEEE 1838 flexible parallel port (FPP) by leveraging the packetized data delivery capabilities of the Tessent Streaming Scan Network (SSN) , which optimize DFT test resources for each block without concern for impacts to the rest of the design
  • Ability to adhere and support multiple different standards like IEEE 1687 and IEEE 1149.1
  • Seamless integration with other Tessent products using an integrated Tessent platform

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