Calibre 3DThermal

Calibre 3DThermal performs highly accurate and computationally efficient thermal analysis throughout the IC design flow. With Calibre 3DThermal, designers of 3DICs now have an integrated chip-package thermal co-design flow that spans early-stage feasibility analysis through to design sign-off.

An image showing, from left to right: an image of a chip-package, then drilling down to the chiplet level, and then to the transistor metal stack level.
Key features

Ensure 3DIC design performance and reliability

Thermal is the largest multi-physics barrier to successful 3DICs.  The Calibre 3DThermal tool offers accurate and easy-to-use analysis of thermal behavior in the dies and in the package and is fully integrated into the IC design flow

Calibre 3DThermal featured resources

Explore our featured resources or visit the full Calibre 3DThermal resource library to view on-demand webinars, white papers and fact sheets.

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