Innovator3D IC (i3D) is a unified cockpit for design planning, prototyping and predictive analysis of 2.5/3D heterogeneous integrated devices that constructs a digital twin unified data model of the complete semiconductor package assembly. By using System Technology Co-optimization (STCO) i3D enables designers to meet their power, performance, area (PPA) and cost objectives.
This demo video will show 3Dblox being imported into Innovator3D IC. Next you will see how to make an edit and then how to export and re-import to see the change. You can learn more about 3Dblox and even request access to a workshop by visiting our resource page.
“For advanced heterogeneous integration platforms such as EMIB, an integrated floorplanning and prototyping cockpit with predictive analysis is essential. Through our collaboration with Siemens EDA, we see Innovator3D IC as an important design technology component for our advanced integration platforms.”
Innovator3D IC use its digital twin to drive ASIC, Chiplet and Interposer implementation using Aprisa and Xpedition Package Designer, Calibre multi-physics analysis, NX mechanical design, Tessent test, Calibre signoff and release to fabrication and manufacturing through a managed and secure design IP digital thread conduit.