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Semiconductor packaging best practices​

Integrated system-level planning and prototyping​

Multi chiplet/ASIC packages with heterogeneous integration need early assembly floorplanning if power, performance, area and cost targets are to be achieved.

IC package assembly planning & co-optimization

An integrated IC package planning and prototyping solution enables architects and designers to construct and optimize complete IC package assemblies for power, performance, area and cost and deliver a well-qualified prototype for implementation.


Hierarchical device planning

This video shows how hierarchical device planning can construct a chiplet/die which is then exported as a device and floorplan replicated on a silicon substrate. 

Integrated system-level planning resources

Learn more about integrated system-level IC package planning and prototyping from system connectivity management, cross-domain interconnect optimization and 3D assembly verification.