Extending physical verification from the IC world to the advanced packaging world to improve multi-die package manufacturability. Use one Calibre cockpit for assembly-level DRC, LVS, and PEX without disruption to traditional packaging formats and tools.
Get in touch with our technical team: 1-800-547-3000
The Calibre 3DSTACK tool extends Calibre die-level signoff verification to complete signoff verification of a wide range of 2.5D and 3D stacked die designs. Designers can run signoff DRC and LVS checking of complete multi-die systems at any process node using existing tool flows and data formats.
The Calibre 3DSTACK tool enables designers to check for accurate alignment between different die in a multi-die package assembly.
The Calibre 3DSTACK tool supports system-level connectivity checking for the multi-die package assembly, allowing designers to verify that dies, interposers and packages are connected as intended.
The Calibre 3DSTACK tool enables designers to check standalone interposer/package connectivity without including the individual die design databases.
We're standing by to answer your questions! Get in touch with our team today:
We help you adopt, deploy, customize, and optimize your complex design environments. Direct access to engineering and product development lets us tap into deep domain and subject matter expertise.
The Siemens Support Center provides you with everything in one easy-to-use location – knowledgebase, product updates, documentation, support cases, license/order information, and more.
Across all process nodes and design styles, the Calibre toolsuite delivers accurate, efficient, comprehensive IC verification and optimization, while minimizing resource usage and tapeout schedules.