Semiconductor Foundry Support

Foundry-specific process flows that are built, tested, and certified

UMC certified reference flow

United Microelectronics Corporation (UMC) provides high quality hybrid bonding of die and wafers for 3D IC integration.

Leading global semiconductor foundry

Providing high quality IC fabrication services and various specialty technologies to serve all major sectors of the electronics industry.

3D IC hybrid bonding workflow

Provides a foundry design kit for 3D IC assembly verification and parasitic extraction using Xpedition Substrate Integrator and Calibre technologies.

Featured products

Xpedition Substrate Integrator

Graphical virtual prototyping and planning environment tuned for the exploration and integration of heterogeneous ASIC/chiplets and interposers using System Technology Co-Optimization (STCO) with predictive multi-physics analysis.

Xpedition Package Designer

Complete physical design and verification solution. Supports heterogeneous integration using the latest silicon and wafer-based technologies such as RDL fan-out wafer-level packaging (FOWLP) and 2.5D/3DIC.

Calibre 3DSTACK

Complete design verification and signoff of heterogeneously integrated assemblies using foundry/OSAT supplied assembly design kits (ADK). Direct integration with Xpedition Package Designer streamlines tapeout readiness.