Siemens works closely with leading semiconductor foundries who offer package fabrication, assembly and test to certify its design and verification technologies.
Taiwan Semiconductor Manufacturing Company (TSMC®) is the world’s largest dedicated semiconductor foundry. TSMC offers multiple advanced IC packaging technologies for which the Siemens EDA IC packaging design solution has been certified.
Supports single, multi-die, or package-on-package. Complete prototyping, design and verification certified.
Integrates logic and memory in 3D targeting, AI, and HPC. Xpedition Substrate Integrator creates, optimizes & manages a 3D model.
Xpedition Substrate Integrator creates, optimizes, and manages a 3D model that drives design.
Xpedition Substrate Integrator optimizes and manages a 3D model that drives design and then verification with Calibre 3DSTACK.
Intel is unleashing its silicon design and manufacturing expertise to build its customer world-changing products.
The embedded multi-die interconnect bridge (EMIB) is a small piece of silicon that is embedded in an organic package substrate cavity. It provides a high-speed high-bandwidth die to die interface pathway. Siemens provides a certified design flow from Die/package co-design, Functional verification, Physical Layout, Thermal, SI/PI/EMIR Analysis and Assembly Verification.