Overview
Semiconductor Foundry support
Foundry-specific process flows that are built, tested, and certified.
Foundry certified reference flows
Siemens works closely with leading semiconductor foundries who offer package fabrication, assembly and test to certify its design and verification technologies.
Key technologies supported
Taiwan Semiconductor Manufacturing Company (TSMC®) is the world’s largest dedicated semiconductor foundry. TSMC offers multiple advanced IC packaging technologies for which the Siemens EDA IC packaging design solution has been certified.
Integrated Fanout (InFO)
Supports single, multi-die, or package-on-package. Complete prototyping, design and verification certified.
Chip on Wafer on Substrate (CoWoS)
Integrates logic and memory in 3D targeting, AI, and HPC. Xpedition Substrate Integrator creates, optimizes & manages a 3D model.
Wafer on Wafer (WoW)
Xpedition Substrate Integrator creates, optimizes, and manages a 3D model that drives design.
System-on-Integrated-Chips (SoIC)
Xpedition Substrate Integrator optimizes and manages a 3D model that drives design and then verification with Calibre 3DSTACK.
UMC certified reference flow
United Microelectronics Corporation (UMC) provides high quality hybrid bonding of die and wafers for 3D IC integration.
3D IC hybrid bonding workflow
Provides a foundry design kit for 3D IC assembly verification and parasitic extraction using Xpedition Substrate Integrator and Calibre technologies.