Foundry-specific process flows that are built, tested, and certified
Heterogeneous and homogeneous 2.5/3D system connectivity IC package planning and prototyping for evaluating different IC, interposer, package, and PCB integration scenarios.
Provides a complete physical design solution, including flip chip and/or wirebond attach, stacked die, heterogeneous integration, and multi-device System-In-Package (SiP) or modules.
Complete design verification of stacked die assemblies, such as stacked memories, stacked sensor arrays, interposer-based structures, and fan-out wafer-level packaging.
