Semiconductor Foundry support

Foundry-specific process flows that are built, tested, and certified.

Foundry certified reference flows

Siemens works closely with leading semiconductor foundries who offer package fabrication, assembly and test to certify its design and verification technologies.

TSMC 3DFabric technologies supported

Taiwan Semiconductor Manufacturing Company (TSMC®) is the world’s largest dedicated semiconductor foundry. TSMC offers multiple advanced IC packaging technologies for which the Siemens EDA IC packaging design solution has been certified.

Integrated Fanout (InFO)

Supports single, multi-die, or package-on-package. Complete prototyping, design and verification certified.

Chip on Wafer on Substrate (CoWoS)

Integrates logic and memory in 3D targeting, AI, and HPC. Xpedition Substrate Integrator creates, optimizes & manages a 3D model.

Wafer on Wafer (WoW)

Xpedition Substrate Integrator creates, optimizes, and manages a 3D model that drives design.

System-on-Integrated-Chips (SoIC)

Xpedition Substrate Integrator optimizes and manages a 3D model that drives design and then verification with Calibre 3DSTACK.

TSMC 3DFabric

Key Intel Foundry technologies

Intel is unleashing its silicon design and manufacturing expertise to build its customer world-changing products.

Embedded Multi-Die Interconnect Bridge (EMIB)

The embedded multi-die interconnect bridge (EMIB) is a small piece of silicon that is embedded in an organic package substrate cavity. It provides a high-speed high-bandwidth die to die interface pathway. Siemens provides a certified design flow from Die/package co-design, Functional verification, Physical Layout, Thermal, SI/PI/EMIR Analysis and Assembly Verification.

Intel Foundry Services

UMC certified reference flow

United Microelectronics Corporation (UMC) provides high quality hybrid bonding of die and wafers for 3D IC integration.