{"heading":"OSAT Alliance Program ","shareURL":"https://eda.sw.siemens.com/en-US/ic-packaging/osat-alliance/","children":"<p>OSAT enables member companies to develop, validate, and support IC package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies looking for greater heterogeneous integration.</p>"}
OSAT Alliance Program
<p>OSAT enables member companies to develop, validate, and support IC package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies looking for greater heterogeneous integration.</p>
{"headingSize":"heading2","sectionHeading":"Enabling Adoption of Emerging Technologies","sectionDescription":"<p>The OSAT Alliance Program recognizes the importance and influence of the supply chain in enabling and promoting the adoption of HDAP. Through OSAT, partners can develop, validate, and support assembly design kits (ADK) so their customers can design more efficiently and predictably.</p>","align":"text-left","parentCard":{"cardTitle":"OSAT alliance partners","cardDescription":"These OSATs have created assembly design kits to enable efficient HDAP design & manufacture.","imgUrl":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/6W4kUlUZp9D2bGFkqCzDfu/en-US/hadap-graph-minus-mentor-feature-640x360.jpg?w=640&q=60","imgAlt":"Circle with information","childCards":[{"cardTitle":"Amkor SmartPackage","cardDescription":"Amkor Technology is the world’s largest automotive OSAT. Amkor developed, tested, and certified the SmartPackage Package Assembly Design Kit (PADK) for the Siemens HDAP solution."},{"cardTitle":"ASE FOCoS and 2.5D MEOL","cardDescription":"ASE are the world’s largest OSAT. In collaboration with Siemens they now offer Assembly Design Kits for two of their leading technologies."},{"cardTitle":"Deca Technologies M-Series ","cardDescription":"Deca developed an M-Series Assembly Design Kit (ADK), which supports the Siemens high density advanced packaging (HDAP) design process and tools."}]},"childCards":[{"cardTitle":"Amkor SmartPackage","cardDescription":"Amkor Technology is the world’s largest automotive OSAT. Amkor developed, tested, and certified the SmartPackage Package Assembly Design Kit (PADK) for the Siemens HDAP solution."},{"cardTitle":"ASE FOCoS and 2.5D MEOL","cardDescription":"ASE are the world’s largest OSAT. In collaboration with Siemens they now offer Assembly Design Kits for two of their leading technologies."},{"cardTitle":"Deca Technologies M-Series ","cardDescription":"Deca developed an M-Series Assembly Design Kit (ADK), which supports the Siemens high density advanced packaging (HDAP) design process and tools."}]}
Enabling Adoption of Emerging Technologies
<p>The OSAT Alliance Program recognizes the importance and influence of the supply chain in enabling and promoting the adoption of HDAP. Through OSAT, partners can develop, validate, and support assembly design kits (ADK) so their customers can design more efficiently and predictably.</p>
OSAT alliance partners
These OSATs have created assembly design kits to enable efficient HDAP design & manufacture.
OSAT alliance partners
These OSATs have created assembly design kits to enable efficient HDAP design & manufacture.
OSAT alliance partners
These OSATs have created assembly design kits to enable efficient HDAP design & manufacture.
