OSAT Alliance Program

OSAT enables member companies to develop, validate, and support IC package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies looking for greater heterogeneous integration.

Enabling Adoption of Emerging Technologies

The OSAT Alliance Program recognizes the importance and influence of the supply chain in enabling and promoting the adoption of HDAP. Through OSAT, partners can develop, validate, and support assembly design kits (ADK) so their customers can design more efficiently and predictably.

Circle with information

OSAT alliance partners

These OSATs have created assembly design kits to enable efficient HDAP design & manufacture.

Amkor SmartPackage

Amkor Technology is the world’s largest automotive OSAT. Amkor developed, tested, and certified the SmartPackage Package Assembly Design Kit (PADK) for the Siemens HDAP solution.

ASE FOCoS and 2.5D MEOL

ASE are the world’s largest OSAT. In collaboration with Siemens they now offer Assembly Design Kits for two of their leading technologies.

Circle with information

OSAT alliance partners

These OSATs have created assembly design kits to enable efficient HDAP design & manufacture.

Amkor SmartPackage

Amkor Technology is the world’s largest automotive OSAT. Amkor developed, tested, and certified the SmartPackage Package Assembly Design Kit (PADK) for the Siemens HDAP solution.

ASE FOCoS and 2.5D MEOL

ASE are the world’s largest OSAT. In collaboration with Siemens they now offer Assembly Design Kits for two of their leading technologies.

Circle with information

OSAT alliance partners

These OSATs have created assembly design kits to enable efficient HDAP design & manufacture.

Amkor SmartPackage

Amkor Technology is the world’s largest automotive OSAT. Amkor developed, tested, and certified the SmartPackage Package Assembly Design Kit (PADK) for the Siemens HDAP solution.

ASE FOCoS and 2.5D MEOL

ASE are the world’s largest OSAT. In collaboration with Siemens they now offer Assembly Design Kits for two of their leading technologies.

Amkor SmartPackage

Amkor Technology is the world’s largest automotive OSAT. Amkor developed, tested, and certified the SmartPackage Package Assembly Design Kit (PADK) for the Siemens HDAP solution.

ASE FOCoS and 2.5D MEOL

ASE are the world’s largest OSAT. In collaboration with Siemens they now offer Assembly Design Kits for two of their leading technologies.

Deca Technologies M-Series

Deca developed an M-Series Assembly Design Kit (ADK), which supports the Siemens high density advanced packaging (HDAP) design process and tools.

Amkor SmartPackage

Amkor Technology is the world’s largest automotive OSAT. Amkor developed, tested, and certified the SmartPackage Package Assembly Design Kit (PADK) for the Siemens HDAP solution.

ASE FOCoS and 2.5D MEOL

ASE are the world’s largest OSAT. In collaboration with Siemens they now offer Assembly Design Kits for two of their leading technologies.

Deca Technologies M-Series

Deca developed an M-Series Assembly Design Kit (ADK), which supports the Siemens high density advanced packaging (HDAP) design process and tools.

Featured Products

Xpedition Substrate Integrator / diagram of multi-chip package

Xpedition Substrate Integrator

Heterogeneous and homogeneous 2.5/3D system connectivity IC package planning and prototyping for evaluating different IC, interposer, package, and PCB integration scenarios.

image showing circles

Xpedition Package Designer

Provides a complete physical design solution, including flip chip and/or wirebond attach, stacked die, heterogeneous integration, and multi-device System-In-Package (SiP) or modules.

Calibre 3DSTACK

Complete design verification of stacked die assemblies, such as stacked memories, stacked sensor arrays, interposer-based structures, and fan-out wafer-level packaging.