Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
Deca’s M-Series™, is a rugged, fully molded fan-out wafer-level package (FOWLP) that provides exceptional reliability, performance, and quality; all in a miniaturized format. M-Series FX is designed into most of the leading smartphones around the globe.
Adaptive Patterning® (AP) extends beyond traditional Design for Manufacturing (DFM), its unique Design-During-Manufacturing (DDM) adapts each design in real-time to accommodate natural process variation producing perfectly aligned interconnects every time on every device.
Through technology transfer and license agreements with ASE, SkyWater, and nepes DECA's M-Series and AP technologies are available to the industry as emerging standards for advanced fan-out and related technologies.
Partnering with Siemens, ASE, & SkyWater, Deca developed an Adaptive Patterning workflow. This workflow encompasses co-design planning, physical implementation through to substrate and package assembly verification. Siemens tuned its Xpedition and Calibre technologies to support Deca’s requirements.