OSAT alliance partner

Deca Technologies

Deca is a pure-play technology provider. Through technology transfer and license agreements with ASE, SkyWater, and nepes M-Series™, a rugged, fully molded fan-out wafer-level package (FOWLP) and Adaptive Patterning® (AP) which enables unique Design-During-Manufacturing (DDM).

Deca Technologies offerings:

Fully molded fan-out wafer-level package

Deca’s M-Series™, is a rugged, fully molded fan-out wafer-level package (FOWLP) that provides exceptional reliability, performance, and quality; all in a miniaturized format. M-Series FX is designed into most of the leading smartphones around the globe.

Adaptive patterning

Adaptive Patterning® (AP) extends beyond traditional Design for Manufacturing (DFM), its unique Design-During-Manufacturing (DDM) adapts each design in real-time to accommodate natural process variation producing perfectly aligned interconnects every time on every device.

Technology provider

Through technology transfer and license agreements with ASE, SkyWater, and nepes DECA's M-Series and AP technologies are available to the industry as emerging standards for advanced fan-out and related technologies.

The partnership of Deca Technologies and Siemens

Partnering with Siemens, ASE, & SkyWater, Deca developed an Adaptive Patterning workflow. This workflow encompasses co-design planning, physical implementation through to substrate and package assembly verification. Siemens tuned its Xpedition and Calibre technologies to support Deca’s requirements.

xPD

Xpedition Package Designer now includes dedicated Adaptive Patterning and Shift regions. These regions are automatically created and inserted reducing a 1-2 day process to just a few minutes.