OSAT Alliance Partner

Amkor Technology

Amkor Technology® is the world's largest automotive outsourced semiconductor assembly and test (OSAT) service. Founded in 1968, Amkor pioneered the outsourcing of IC packaging and test.

Amkor Technologies- Swift HDFO

Amkor's Mission

The mission of Amkor Technology® is to be a trusted provider of reliable assembly and test manufacturing services and innovative solutions to semiconductor and microelectronics companies around the world. Now a strategic manufacturing partner for more than 300 of the world’s leading semiconductor companies, foundries, and electronics OEMs, Amkor's close collaboration with customers and supply chain partners has led to advanced technology that significantly reduces cycle time.​

The partnership of Amkor Technology and Siemens

Partnering with Siemens, Amkor developed, tested, and certified the SmartPackage™ Package Assembly Design Kit (PADK), the industry’s first ADK to support Siemens High Density Advanced Packaging (HDAP) design process and tools. Together, Amkor’s award-winning High-Density Fan Out (HDFO) process and Siemens industry-leading technologies can be used to speed the accurate design and verification of the advanced packages required for Internet-of-Things (IoT), automotive, high-speed communications, computing, and artificial intelligence (AI) applications.

"Amkor leads the way in HDFO technology for OSAT companies, and with the rise of complex ICs with multi-die packages, we prioritized the creation of Mentor-based PADKs to significantly reduce cycle time."
Ron Huemoeller, Corporate Vice President, Research & Development, Amkor Technology
"Amkor was the first OSAT company to join the Mentor OSAT Alliance program, and now the first to build and make available a PADK for its customers."
AJ Incorvaia, Vice President , Siemens Digital Industries Software

Learn more about the OSAT Alliance Program

OSAT enables member companies to develop, validate, and support IC package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies looking for greater heterogeneous integration.