The mission of Amkor Technology® is to be a trusted provider of reliable assembly and test manufacturing services and innovative solutions to semiconductor and microelectronics companies around the world. Now a strategic manufacturing partner for more than 300 of the world’s leading semiconductor companies, foundries, and electronics OEMs, Amkor's close collaboration with customers and supply chain partners has led to advanced technology that significantly reduces cycle time.
Partnering with Siemens, Amkor developed, tested, and certified the SmartPackage™ Package Assembly Design Kit (PADK), the industry’s first ADK to support Siemens High Density Advanced Packaging (HDAP) design process and tools. Together, Amkor’s award-winning High-Density Fan Out (HDFO) process and Siemens industry-leading technologies can be used to speed the accurate design and verification of the advanced packages required for Internet-of-Things (IoT), automotive, high-speed communications, computing, and artificial intelligence (AI) applications.
OSAT enables member companies to develop, validate, and support IC package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies looking for greater heterogeneous integration.