Xpedition IC Packaging Solutions

Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.

Episode 1

New 3D IC Podcast Launch

In this episode, you’ll learn about the current chip standards in the industry and where they fall short. You’ll also learn how 3D IC works and how it will help in solving most of the challenges facing today’s chips.

High density advanced packaging (HDAP) product trials

Explore the differentiated capabilities of the Xpedition and Calibre technologies in these self-contained cloud-hosted virtual laboratories.