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Xpedition IC Packaging Solutions

Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.

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What’s New in IC Packaging?

Find out what enhancements and capabilities have been added in the latest release.

What's new in IC Packaging

Xpedition IC Packaging Design

Xpedition IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D, or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design, and substrate layout implementation.

{"desc":"This site uses cookies in order to improve your user experience and to provide content tailored specifically to your interests. Detailed information on the use of cookies on this website is provided in our Privacy Policy. You can also manage your preferences there. By using this website, you consent to the use of cookies.","learnMoreText":"Learn More","learnMoreUrl":"https://new.siemens.com/global/en/general/cookie-notice.html","okText":"OK"}