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adcom pcb design using xpedition

Xpedition IC Packaging Solutions

Bringing IC package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for rapid prototyping/planning of the IC package assembly, physical design, verification, signoff & modeling.

IC packaging design & verification

Monolithic scaling limitations drive the growth of 2.5/3D multi-chiplet, heterogeneous integration that enables PPA targets to be met. Our integrated flow addresses IC package prototyping challenges to signoff for FOWLP, 2.5/3D IC, and other emerging integration technologies.

3D IC Podcast

Take a deep dive into the 3D IC podcast series to learn how three-dimensional integrated circuits take less space and deliver higher performance.