Xpedition IC Packaging Solutions

Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.

Explore VX.2.12

Product release highlights for IC Packaging VX.2.12

Find out what enhancements and capabilities have been added in the latest release.

What's new in Xpedition IC Packaging VX.2.12

Xpedition IC Packaging VX.2.12 delivers capabilities targeting heterogeneous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies.

What’s new in Xpedition IC Packaging VX.2.11

Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogeneous integration and the prototyping, planning, design, and verification of next-generation 2.5/3D package assemblies.

What's new in IC Packaging VX.2.10

Xpedition IC Packaging VX.2.10 delivers capabilities targeted at the prototyping, planning, and design of next-generation 2.5/3D heterogeneous packages.

Xpedition IC Packaging Design

Xpedition IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D, or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design, and substrate layout implementation.

Xpedition Substrate Integrator

Graphical virtual prototyping and planning environment tuned for the exploration and integration of heterogeneous ASIC/chiplets and interposers using System Technology Co-Optimization (STCO) with predictive multi-physics analysis.

Xpedition Package Designer

Complete physical design and verification solution. Supports heterogeneous integration using the latest silicon and wafer-based technologies such as RDL fan-out wafer-level packaging (FOWLP) and 2.5D/3DIC.

IC Package Simulation

Analysis of die/package signal and power integrity, EM coupling, and thermal conditions. Fast, easy to use, and accurate, these tools ensure that engineering intent is fully achieved.

Signal Integrity Analysis

Ensure that you are getting designs right the first time, avoiding costly overdesign, and saving recurrent test cycles with built-in HyperLynx signal integrity analysis in PADS Professional.

HyperLynx Power Integrity

Accurately model power distribution networks and noise propagation mechanisms to identify potential power integrity distribution issues that interfere with package design logic and validate solutions.

Calibre xACT

Integrated capacitance field solver delivers reference-level accuracy with deterministic results.

Simcenter Flotherm

A powerful suite of 3D computational fluid dynamics (CFD) software to predict airflow and heat transfer in and around complex 3D IC Package assemblies and associated PCB systems.

System-Level Package Signoff

Physical verification and signoff that meet foundry and OSAT requirements ensure performance and time-to-market goals are met.

Industry-leading DRC

Calibre nmDRC

The Calibre nmDRC platform enables reduced cycle time with revolutionary new capabilities that substantially differentiate Calibre nmDRC design rule checking from traditional DRC tools.

Extends Calibre Verification

Calibre 3DSTACK

Calibre 3DSTACK technology provides comprehensive support for an extensive range of multi-die integration methodologies and processes, including system-level DRC, LVS, and PEX.

Optimize PCB Design & Mfg

Valor NPI

Maximizes design to manufacturing efficiencies by identifying potential manufacturing issues while in the design stage.

High density advanced packaging (HDAP) product trials

Explore the differentiated capabilities of the Xpedition and Calibre technologies in these self-contained cloud-hosted virtual laboratories.

View trials