Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.
In this episode, you’ll learn about the current chip standards in the industry and where they fall short. You’ll also learn how 3D IC works and how it will help in solving most of the challenges facing today’s chips.
Find out what enhancements and capabilities have been added in the latest release.
Xpedition IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D, or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design, and substrate layout implementation.
Analysis of die/package signal and power integrity, EM coupling, and thermal conditions. Fast, easy to use, and accurate, these tools ensure that engineering intent is fully achieved.
Physical verification and signoff that meet foundry and OSAT requirements ensure performance and time-to-market goals are met.
Explore the differentiated capabilities of the Xpedition and Calibre technologies in these self-contained cloud-hosted virtual laboratories.