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{"heading":"Xpedition IC Packaging Solutions","shareURL":"https://eda.sw.siemens.com/en-US/ic-packaging/software/","children":"<p>Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.</br></p>"}

Xpedition IC Packaging Solutions

<p>Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.</br></p>
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What’s New in IC Packaging?

<p>Find out what enhancements and capabilities have been added in the latest release. </p>

What's new in IC Packaging