Xpedition IC Packaging Solutions

Graphical virtual prototyping & planning environment tuned for the exploration and integration of heterogeneous ASIC/chiplets and interposers using System Technology Co-Optimization (STCO) with predictive multi-physics analysis.

Complete physical design and verification solution. Supports heterogeneous integration using the latest silicon and wafer-based technologies such as RDL fan-out wafer
level packaging (FOWLP) and 2.5D/3DIC​.

Ensure that you are getting designs right the first time, avoiding costly overdesign, and saving recurrent test cycles with built-in HyperLynx signal integrity analysis in PADS Professional.

Accurately model power distribution networks and noise propagation mechanisms to identify potential power integrity distribution issues that interfere with package design logic and validate solutions.

Integrated capacitance field solver delivers reference-level accuracy with deterministic results.

A powerful suite of 3D computational fluid dynamics (CFD) software to predict airflow and heat transfer in and around complex 3D IC Package assemblies and associated PCB systems.

The Calibre nmDRC platform enables reduced cycle time with revolutionary new capabilities that substantially differentiate Calibre nmDRC design rule checking from traditional DRC tools.

Calibre 3DSTACK technology provides comprehensive support for an extensive range of multi-die integration methodologies and processes, including system-level DRC, LVS, and PEX.

Maximizes design to manufacturing efficiencies by identifying potential manufacturing issues while in the design stage.