Advanced IC Packaging solutions

Delivers the fastest and most predictable path for planning and heterogeneous integration of ASICs and chiplets using the latest semiconductor packaging 2.5D and 3D technology platforms and substrates. ​

Complete physical design and verification solution. Supports heterogeneous integration using the latest silicon and wafer-based technologies such as RDL, fan-out wafer-level packaging (FOWLP) and 2.5D/3DIC.

Graphical virtual prototyping and planning environment tuned for the exploration and integration of heterogeneous ASIC/chiplets and interposers using System Technology Co-Optimization (STCO) with predictive multi-physics analysis.

Ensure that you are getting designed right the first time, avoiding costly overdesign and saving test cycles with HyperLynx Signal Integrity.

Accurately model power distribution networks and noise propagation mechanisms to identify potential power integrity/distribution issues that interfere with package design logic and validating solutions.

Integrated capacitance field solver delivers reference-level accuracy with deterministic results.

A powerful suite of 3D computational fluid dynamics (CFD) software to predict airflow and heat transfer in and around complex 3D IC Package assemblies and associated PCB systems.

Perform highly accurate and computationally efficient thermal analysis of advanced semiconductor package assemblies that span predictive feasibility analysis through to design sign-off.​

The Calibre nmDRC platform enables reduced cycle time with revolutionary new capabilities that substantially differentiate Calibre nmDRC design rule checking from traditional design rule checking (DRC) tools.

Calibre 3DSTACK technology provides comprehensive support for an extensive range of multi-die integration methodologies and processes, including system-level DRC, layout versus schematic (LVS) and parasitic extraction (PEX).

Maximize design to manufacturing efficiencies by identifying potential manufacturing issues while in the design stage.