Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.
Find out what enhancements and capabilities have been added in the latest release.
Xpedition IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D, or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design, and substrate layout implementation.
Analysis of die/package signal and power integrity, EM coupling, and thermal conditions. Fast, easy to use, and accurate, these tools ensure that engineering intent is fully achieved.
Physical verification and signoff that meet foundry and OSAT requirements ensure performance and time-to-market goals are met.