Xpedition IC Packaging Solutions

Heterogeneous and homogeneous 2.5/3D system connectivity IC package planning and prototyping for evaluating different IC, interposer, package, and PCB integration scenarios.

Provides a complete physical design solution, including flip chip and/or wirebond attach, stacked die, heterogeneous integration, and multi-device System-In-Package (SiP) or modules.

Ensure that you are getting designs right the first time, avoiding costly overdesign, and saving recurrent test cycles with built-in HyperLynx signal integrity analysis in PADS Professional.

Accurately model power distribution networks and noise propagation mechanisms to identify potential power integrity distribution issues that interfere with package design logic and validate solutions.

Integrated capacitance field solver delivers reference-level accuracy with deterministic results.

A powerful suite of 3D computational fluid dynamics (CFD) software to predict airflow and heat transfer in and around electronic equipment.

The Calibre nmDRC platform enables reduced cycle time with revolutionary new capabilities that substantially differentiate Calibre nmDRC design rule checking from traditional DRC tools.

Calibre 3DSTACK technology provides comprehensive support for an extensive range of multi-die integration methodologies and processes, including system-level DRC, LVS, and PEX.

Maximizes design to manufacturing efficiencies by identifying potential manufacturing issues while in the design stage.