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{"heading":"IC Packaging Design Flows","shareURL":"https://eda.sw.siemens.com/en-US/ic-packaging/design-flows/","align":"text-center","children":"<p>Today&#39;s high-performance products require advanced IC packaging that utilizes heterogeneous silicon (chiplets) to be integrated into multi-chip, wafer-based HDAP packages. Different vertical markets often have specific needs and corresponding design flows as shown below.</p>"}

IC Packaging Design Flows

<p>Today&#39;s high-performance products require advanced IC packaging that utilizes heterogeneous silicon (chiplets) to be integrated into multi-chip, wafer-based HDAP packages. Different vertical markets often have specific needs and corresponding design flows as shown below.</p>
{"headingSize":"heading2","sectionDescription":"","parentCard":{"cardTitle":"Common Industry Design Flows ","cardDescription":"Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.","imgUrl":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/1yLio2zLPWip3NH2OzvPsA/en-US/DesignFlows_640x360.png?w=640&q=60","imgAlt":"Hand holding an electric board design flows","childCards":[{"cardTitle":"Systems Companies ","cardDescription":"By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages."},{"cardTitle":"Defense & Aerospace Companies","cardDescription":"Multi-chip modules developed in the context of their PCBs meet performance and size requirements."},{"cardTitle":"OSATs & Foundries ","cardDescription":"Package design and verification requires cooperation with end-product customers."},{"cardTitle":"Fabless Semiconductor Companies ","cardDescription":"Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs."}]},"childCards":[{"cardTitle":"Systems Companies ","cardDescription":"By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages."},{"cardTitle":"Defense & Aerospace Companies","cardDescription":"Multi-chip modules developed in the context of their PCBs meet performance and size requirements."},{"cardTitle":"OSATs & Foundries ","cardDescription":"Package design and verification requires cooperation with end-product customers."},{"cardTitle":"Fabless Semiconductor Companies ","cardDescription":"Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs."}]}
Hand holding an electric board design flows

Common Industry Design Flows

Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.

Systems Companies

By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.

Defense & Aerospace Companies

Multi-chip modules developed in the context of their PCBs meet performance and size requirements.
Hand holding an electric board design flows

Common Industry Design Flows

Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.

Systems Companies

By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.

Defense & Aerospace Companies

Multi-chip modules developed in the context of their PCBs meet performance and size requirements.
Hand holding an electric board design flows

Common Industry Design Flows

Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.

Systems Companies

By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.

Defense & Aerospace Companies

Multi-chip modules developed in the context of their PCBs meet performance and size requirements.

Systems Companies

By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.

Defense & Aerospace Companies

Multi-chip modules developed in the context of their PCBs meet performance and size requirements.

OSATs & Foundries

Package design and verification requires cooperation with end-product customers.

Systems Companies

By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.

Defense & Aerospace Companies

Multi-chip modules developed in the context of their PCBs meet performance and size requirements.

OSATs & Foundries

Package design and verification requires cooperation with end-product customers.