IC Packaging Design Flows

Systems Companies

By integrating functionality into systems-in-packages, automotive suppliers can deliver greater electronics capability in a smaller, more reliable and lower cost form factor. Companies that incorporate custom high performance semiconductor into their system PCBs, such as telecom, networking switches, data center hardware, and high-performance computer peripherals, require heterogeneous integration to meet performance, size, and manufacturing costs. A key component of the Siemens semiconductor packaging solution is Innovator3D IC where chiplets/ASICs, package, and system PCB substrate technologies can be prototyped, integrated, and optimized using the system PCB as a reference to drive package ball-out and signal assignments to provide best-in-class results.​

Lower costs are also achieved by integrating functionality into systems-in-package (SiP), a fact that automotive sub-system suppliers leverage when developing mmWave technologies and products.

Defense & Aerospace Companies

Multi-chip modules (MCM) and System-In-Packages (SiP) developed in the context of their PCBs to meet performance and size requirements. Commonly utilized by military and aerospace companies in order to meet performance and size/weight requirements. Particularly important is the ability to prototype and explore the logical and physical architecture before moving to physical design. Innovator3D IC provides rapid multi-substrate prototyping and assembly visualization for MCM and SiP planning and optimization.​

OSATs & Foundries

Package design and verification requires cooperation with end-product customers. By using common tools that have the integration and functionality needed to operate in both the semiconductor and packaging domains and by developing and deploying verified process-optimized design kits (such as PADK’s and PDKs), OSATs, foundries, and their customers can achieve design, fabrication, and assembly predictability and performance.​

Fabless Semiconductor Companies

Semiconductor package prototyping and planning using an STCO methodologies has become mandatory as is the need for PADK/PDK from the foundry or OSATs. Heterogeneous integration is critical to markets where performance, low power, and/or size or weight are key. Innovator3D IC helps companies' prototype, integrate, optimize, and verify the IC, package, and reference PCB substrate technologies. The ability to consume PADK/PDK for manufacturing signoff is also key, and the use of Calibre technologies provides both consistency of quality and reduced risk.​