Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages. Companies that incorporate custom ASICs and SoCs on their PCBs, such as telecom, networking switches, data center hardware, and high-performance computer peripherals, require optimized IC packages to meet performance, size, and manufacturing costs. A key component of the Xpedition HDAP flow is Xpedition Substrate Integrator where IC, package, and system PCB substrate technologies can be prototyped, integrated, and optimized using the system PCB as a reference to drive package ball-out and signal assignments to provide best-in-class physical verification and signoff.
Lower costs are also achieved by integrating functionality into systems-in-package (SiP), a fact that automotive sub-system suppliers leverage when developing mmWave technologies and products.
Multi-chip modules developed in the context of their PCBs meet performance and size requirements. Commonly developed by military and aerospace companies, multi-chip modules (MCMs) and SiP developed in context of their PCBs are better equipped to meet performance and size requirements. Particularly important is the ability to prototype and explore the logical and physical architecture before moving to physical design. Xpedition® Substrate Integrator provides rapid multi-substrate prototyping and assembly visualization for package planning and optimization.
Package design and verification requires cooperation with end-product customers. HDAP design and verification require cooperation and collaboration between design houses, OSATs, foundries, and EDA vendors. By using common tools that have the integration and functionality needed to operate in both the IC and packaging domains and by developing and deploying verified process-optimized design kits (such as ADK’s and PDKs), OSATs, foundries, and their customers can achieve design, fabrication, and assembly predictability and package performance.
Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADK's from the foundry or OSATs. HDAP design is critical to markets where performance, low power, and/or size or weight are key. Xpedition Substrate Integrator helps companies prototype, integrate, optimize, and verify IC, package, and reference PCB substrate technologies. The ability to consume ADK/PDK for manufacturing signoff is key, and the use of Calibre technology provides both consistency and reduced risk/adoption.
TSMC’s 3Dblox language is an open standard designed to foster open interoperability between EDA design tools when designing 3DIC heterogeneous integrated semiconductor devices. Siemens is proud to be a subcommittee member and is committed to collaborate with other committee members and to drive the development and adoption of the 3Dblox hardware description language.
In this video, you will learn about designing silicon interposers for 2.5/3DIC heterogenous integration.