{"heading":"IC Packaging Design Flows","shareURL":"https://eda.sw.siemens.com/en-US/ic-packaging/design-flows/","align":"text-center","children":"<p>Today's high-performance products require advanced IC packaging that utilizes heterogeneous silicon (chiplets) to be integrated into multi-chip, wafer-based HDAP packages. Different vertical markets often have specific needs and corresponding design flows as shown below.</p>"}
IC Packaging Design Flows
<p>Today's high-performance products require advanced IC packaging that utilizes heterogeneous silicon (chiplets) to be integrated into multi-chip, wafer-based HDAP packages. Different vertical markets often have specific needs and corresponding design flows as shown below.</p>
{"headingSize":"heading2","sectionDescription":"","parentCard":{"cardTitle":"Common Industry Design Flows ","cardDescription":"Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.","imgUrl":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/1yLio2zLPWip3NH2OzvPsA/en-US/DesignFlows_640x360.png?w=640&q=60","imgAlt":"Hand holding an electric board design flows","childCards":[{"cardTitle":"Systems Companies ","cardDescription":"By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages."},{"cardTitle":"Defense & Aerospace Companies","cardDescription":"Multi-chip modules developed in the context of their PCBs meet performance and size requirements."},{"cardTitle":"OSATs & Foundries ","cardDescription":"Package design and verification requires cooperation with end-product customers."},{"cardTitle":"Fabless Semiconductor Companies ","cardDescription":"Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs."}]},"childCards":[{"cardTitle":"Systems Companies ","cardDescription":"By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages."},{"cardTitle":"Defense & Aerospace Companies","cardDescription":"Multi-chip modules developed in the context of their PCBs meet performance and size requirements."},{"cardTitle":"OSATs & Foundries ","cardDescription":"Package design and verification requires cooperation with end-product customers."},{"cardTitle":"Fabless Semiconductor Companies ","cardDescription":"Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs."}]}
Common Industry Design Flows
Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
Common Industry Design Flows
Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
Common Industry Design Flows
Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
