Overview
OSIC Packaging Design Flows
Today's high-performance products require advanced IC packaging that utilizes heterogeneous silicon (chiplets) to be integrated into multi-chip, wafer-based HDAP packages. Different vertical markets often have specific needs and corresponding design flows as shown below.
Common industry design flows
Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
Common industry design flows
Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
Systems Companies
By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.
Defense & Aerospace Companies
Multi-chip modules developed in the context of their PCBs meet performance and size requirements.
OSATs & Foundries
Package design and verification requires cooperation with end-product customers.
Fabless Semiconductor Companies
Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADK's from the foundry or OSATs.