Today's high-performance products require advanced IC packaging that utilizes heterogeneous silicon (chiplets) to be integrated into multi-chip, wafer-based HDAP packages. Different vertical markets often have specific needs and corresponding design flows as shown below.
Common Industry Design Flows
Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
Systems Companies
By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.
Defense & Aerospace Companies
Multi-chip modules developed in the context of their PCBs meet performance and size requirements.
OSATs & Foundries
Package design and verification requires cooperation with end-product customers.
Fabless Semiconductor Companies
Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs.
Common Industry Design Flows
Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
Systems Companies
By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.
Defense & Aerospace Companies
Multi-chip modules developed in the context of their PCBs meet performance and size requirements.
OSATs & Foundries
Package design and verification requires cooperation with end-product customers.
Fabless Semiconductor Companies
Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs.
Common Industry Design Flows
Advanced IC packaging is critical to industries where high-performance is mandatory, such as fabless, systems, defense and aerospace, OSATs and foundries.
Systems Companies
By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.
Defense & Aerospace Companies
Multi-chip modules developed in the context of their PCBs meet performance and size requirements.
OSATs & Foundries
Package design and verification requires cooperation with end-product customers.
Fabless Semiconductor Companies
Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs.
Systems Companies
By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.
Defense & Aerospace Companies
Multi-chip modules developed in the context of their PCBs meet performance and size requirements.
OSATs & Foundries
Package design and verification requires cooperation with end-product customers.
Fabless Semiconductor Companies
Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs.
Systems Companies
By integrating functionality into systems-in-packages, automotive suppliers can leverage these advanced IC packages.
Defense & Aerospace Companies
Multi-chip modules developed in the context of their PCBs meet performance and size requirements.
OSATs & Foundries
Package design and verification requires cooperation with end-product customers.
Fabless Semiconductor Companies
Prototyping, planning, and STCO methodologies and technologies become mandatory as the need for ADKs from the foundry or OSATs.
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