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IC Packaging Design & Verification
<p>Complete Solution for IC Package Design</p>

Drive for Emerging Technologies

Cost, risk, and monolithic scaling limitations drive the growth of multi-die heterogeneous and homogeneous advanced IC packaging solutions. By bringing the traditional IC and IC package design worlds together, a comprehensive HDAP flow meets the unique challenges of HDAP design and verification.

Explore IC Packaging & Verification Challenges

Today's high-performance products demand advanced IC packaging. These products require heterogeneous silicon (chiplets) to be integrated into multi-chip, wafer-based HDAP packages, such as FOWLP, 2.5/3DIC, SiP, and CoWoS. These packages must be optimized for the target system’s PCB(s).