The Siemens 3D IC Designer solution is tightly integrated with advanced package and silicon design implementation tools and serves as the design cockpit to the complementary Siemens 3D IC Architect, Analysis, Reliability and Test workflow solutions.
Additional data management support is integrated to ensure all co-design and analysis teams use the most up-to-date version of IP and intermediate design views.
Leverage a graphical, rapid virtual prototyping environment tuned for exploration and integration of multiple heterogeneous ICs/chiplets and interposers into advanced package assemblies.
Use a complete, powerful and proven physical implementation and verification solution for package substrate and interposes for full heterogeneous integrations of die/chiplets and all die attachment types.
Complete comprehensive verification at the physical and logical levels including substrate DRC using OSAT/Foundry PDK and package assembly LVS using manufacturing mask data.
Advanced 2.5D and 3D IC design made simple to get to market faster and build better designs.