3D IC Design Solutions
3D IC Designer: Streamline your 3D IC design process
The Siemens 3D IC Designer workflow solution includes planning, implementation and validation tools to support advanced 2.5D and 3D IC package designs.
What is 3D IC Designer?
The Siemens 3D IC Designer solution is tightly integrated with advanced package and silicon design implementation tools and serves as the design cockpit to the complementary Siemens 3D IC Architect, Analysis, Reliability and Test workflow solutions.
Additional data management support is integrated to ensure all co-design and analysis teams use the most up-to-date version of IP and intermediate design views.
Benefits of 3D IC Designer
Package Planning & Prototyping
Leverage a graphical, rapid virtual prototyping environment tuned for exploration and integration of multiple heterogeneous ICs/chiplets and interposers into advanced package assemblies.
Package Physical Layout
Use a complete, powerful and proven physical implementation and verification solution for package substrate and interposes for full heterogeneous integrations of die/chiplets and all die attachment types.
Package Assembly Verification
Complete comprehensive verification at the physical and logical levels including substrate DRC using OSAT/Foundry PDK and package assembly LVS using manufacturing mask data.
Key Capabilities of 3D IC Designer
Advanced 2.5D and 3D IC design made simple to get to market faster and build better designs.
- SiP level package planning
- Power delivery network planning/layout
- Substrate planning/layout
- Interposer planning/layout
- SiP Level LEC & DRC validation
- SIP IO planning
- ASIC/Chiplet IO planning
- Design & IP data management
- Design cockpit to Siemens 3D IC Architect, Analysis, Reliability & Test workflows
