1. Home

Xpedition IC Packaging Solutions

Bringing package and IC design together with tools that operate in both the IC and packaging domains, the Xpedition HDAP (High-Density Advanced Packaging) flow offers a complete solution for HDAP rapid prototyping assembly, physical design, verification, signoff, and modeling.

{"items":[{"title":"What’s New in IC Packaging? ","subtitle":"Learn More","background":"pale-blue","description":"<p>Find out what enhancements and capabilities have been added in the latest release. </p>","button":{"text":"Watch Video","url":"https://www.youtube.com/playlist?list=PLNMpvostuCmE2I0sfVa6Lvnc_Pu_vYkTD"},"image":"https://images.sw.siemens-cdn.com/siemens-disw-assets/public/5FRGhdvHxVRFj8E6yxecSC/en-US/whats-new-promo-640x480.jpg?w=640&q=60","imageAlt":"What's new in IC Packaging","imageTitle":"What's new in IC Packaging","rightIcon":"fal fa-long-arrow-right fa-lg"}],"env":"master"}

Learn More

What’s New in IC Packaging?

<p>Find out what enhancements and capabilities have been added in the latest release. </p>

What's new in IC Packaging

Xpedition IC Packaging Design

Xpedition IC Packaging Design tools provide a complete design solution for creating complex, multi-die homogeneous or heterogeneous devices using FOWLP, 2.5/3D, or system-in-package (SiP) modules, as well as IC package assembly prototyping, planning, co-design, and substrate layout implementation.