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Increase reliability

Diagnose and analyze failure and yield data on individual customer returns or volume production data. This provides valuable design and process feedback to improve the reliability of future processes and designs.

White Paper

Enabling the next step in IC test and monitoring

Manage the entire lifecycle of a product from inception through design, realization, deployment to end-of-life activities, such as final disposal using the Tessent product lifecycle management (PLM) concept. This white paper explains the drivers and benefits for the semiconductor industry.

Tessent Silicon Lifecycle Solutions - Enabling the next step in IC test and monitoring diagram

Explore solution areas

Leverage Tessent Safety and Security solutions to improve your business, reduce risks and get to market faster. Explore our solutions and learn more about how they can help your business.

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Ensure quality

Ensure the highest manufacturing test quality with Tessent solutions. Maximize the number of detected physical defects in your zero-defect test solution.

Engineer testing aerodynamics with a modern eco-friendly red electric sports car in a wind tunnel. The tester is working on a laptop and changes testing options.
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Enhance safety

Reduce risk and meet required safety standards with comprehensive in-system test and fault grading solutions, ensuring that your product is fully compliant for the safety-critical applications it is designed for.

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Optimize security

Implement a comprehensive security solution for your IC product, addressing authentication, communication, protection and device lifecycle management across test, functional operation and system-level security.

Discover related technologies

Increase reliability by using the diagnostics and yield analysis capabilities of Tessent Security solutions. Get valuable design and process feedback with early failure prediction and cost-effective safety solutions.

Tessent
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Embedded Analytics

Operate an intelligent, functional monitoring and analytics infrastructure for system-on-chip (SoC) with silicon intellectual property (IP) and software.

Tessent
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Tessent Diagnosis

Accurately classify and identify the location of defects causing failures during manufacturing test with layout-aware and cell-aware diagnosis technologies.

Tessent
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YieldInsight

Helps eliminate noise from diagnosis data so you can determine underlying root causes, identify systematic yield limiters and select the best devices for failure analysis.

Illustration of a padlock with a blue and green background and a circuit board drawing on the padlock.

Security by Design podcast series

Listen to the latest episode in this podcast series, Cybersecurity in Automotive Systems.

Listen now

Learn more

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Security trends in the automotive market

Electronics Weekly video interview

Learn about automotive cyber safety and security trends and the future of mobility technology security. Find out how Siemens EDA represents a smart choice for automotive companies within the ecosystem.

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Chip monitoring for max performance and security

Semiconductor Engineering article

Ensure quality, enhance safety, optimize performance and increase reliability by embedding small modules directly into your system-on-chip (SoC), allowing non-intrusive observation of what's happening in your design.

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Curbing automotive cybersecurity attacks

Semiconductor Engineering article

Read how a growing number of standards and regulations within the automotive ecosystem are promising to save development costs by fending off cyberattacks.