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Calibre 3D IC

The Calibre suite of tools enable confidence in successful 3D IC design from early floor plan through final sign-off.

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Drawing showing a three dimensional integrated circuit layers.
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Calibre 3D IC verification and analysis platform

Ensure fast and accurate DRC, LVS, PEX and PERC reliability verification across the entire 3D IC, supporting any of the most advanced 3D IC processes. Based on core technology to represent true heterogeneous multi-die heterogeneous processes, this platform further extends into the multi-physics analysis domain to ensure proper chiplet-level electrical behavior.

Rendering show a 3d IC on a printed circuit board.

Calibre 3D IC products

The Calibre line of 3D IC products provides physical and circuit verification, including support for post-layout netlist simulation including multi-physics and other reliability impacts, enabling designers to verify the electrical integrity of their assemblies.

Calibre 3Dthermal Package Molding screenshot.
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Calibre 3DThermal​

Perform highly accurate and computationally efficient thermal analysis of advanced semiconductor package assemblies that span predictive feasibility analysis through to design sign-off.​

Rendering showing a 3d stack.
Extends Calibre verification
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Calibre 3DSTACK

Calibre 3DSTACK technology provides comprehensive support for an extensive range of multi-die integration methodologies and processes, including system-level DRC, layout versus schematic (LVS) and parasitic extraction (PEX).