Full-wave, quasi-static, and hybrid 3D electromagnetic solutions for PCB system design.
Solves small, critical structures up to very high frequencies, typically for SerDes channels. Solver jobs can be distributed across all the cores in a computer and across multiple machines.
Efficient, full-package model creation well-suited for complete-system SPICE model generation, while accounting for skin effect impact on resistance and inductance.
Ideal for solving larger planar structures like PCBs. Tightly integrated with HyperLynx SI/PI for power-integrity analysis and signal/PDN extraction to support power-aware simulation.
Common environment front-end design editing, simulation setup/control, and graphical results processing. Users can run the same project in different solvers and compare results.