Tessent Advanced DFT

Tessent Multi-Die

Next-generation devices increasingly feature complex architectures that connect dies vertically (3D IC) or side-by-side (2.5D) and behave as a single device. Tessent Multi-die software delivers comprehensive automation for the highly complex design for test (DFT) tasks associated with these designs.

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Why Tessent Multi-die?

Dramatically speed and simplify critical design-for-test (DFT) tasks for next-generation integrated circuits (ICs) based on 2.5D and 3D architectures with Tessent Multi-die.

Solve complex 3D stacking challenges

Tessent Multi-die provides a comprehensive DFT automation solution for highly complex tasks associated with 2.5D and 3D IC designs and works seamlessly with Tessent TestKompress, Streaming Scan Network and IJTAG software.

Seamless integration

Tessent Multi-die seamlessly integrates with other Tessent products using an integrated Tessent platform.

Automate 3D IC DFT

Faster, simpler DFT enables IC design teams to generate compliant hardware rapidly. DFT technology that keeps pace with multi-dimensional designs allows for quicker test implementation and optimized manufacturing test costs.

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Webinar

DFT for chiplets and 3D IC's using Tessent Multi-die

DFT for chiplets must be general purpose to be tested stand alone and easy to test after assembly in 2.5D/3D devices. Learn how to use Tessent Multi-die and still adhere to standards like IEEE 1149.1, IEEE 1500 and IEEE 1838.

Press Release

Siemens and TSMC collaborate on tool certifications

Siemens announces that ongoing collaboration with longtime partner TSMC has successfully achieved multiple new product certifications and project milestones for TSMC’s newest and most advanced processes.

Picture of an integrated circuit chip on a dark bluish purple printed circuit board with traces in every direction lit up in light blue. There are also spots of gold lights in various areas surrounding the chip.

White Paper

AI chip DFT techniques for aggressive time-to-market

AI chips have aggressive time-to-market goals. Designers can shave significant time off of DFT and silicon bring up using the techniques described in this paper.

Webinar

Implementing DFT in 2.5/3D designs using Tessent

Learn how design for test (DFT) stakeholders can use Tessent Multi-die software for automation of highly complex DFT tasks associated with 2.5D and 3D designs

Fact Sheet