OSAT Alliance Program

Amkor Technology is the world's largest automotive OSAT. Amkor developed, tested, and certified the SmartPackage Package Assembly Design Kit (PADK) for the Siemens HDAP solution.

ASE is the world's largest OSAT. In collaboration with Siemens, they now offer Assembly Planning and 3D LVS verification of their FOPoP, FOCoS, FOCoS-Bridge, and 2.5/3D technologies

Deca developed an M-Series Assembly Design Kit (ADK), which supports the Siemens high density advanced packaging (HDAP) design process and tools.

Mosaic Microsystems is a leader in microelectronics and photonics packaging with a primary focus on enabling the use of thin glass substrates with low loss, low roughness and ability to scale to large area formats, providing solutions for interposers and other packaging substrates.

NHanced will employ Siemens EDA technologies to develop ADKs for their silicon interposer-based technology which targets the Industrial, medical, military and scientific industry segments.