Tessent Connect reduces DFT implementation effort with an optimal automation of the Tessent Shell flow for hierarchical DFT. This addresses the challenges of implementing hierarchical DFT by using intent-driven automation, universal test infrastructure, and future-proof customization.
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Tessent Connect helps IC design teams achieve manufacturing test quality goals faster and with fewer resources compared to traditional DFT methods. This production-proven automation enables a simple, consolidated hand-off between teams, resulting in a sustainable and predictable flow.
With Tessent Connect, you define your intent rather than step-by-step instructions. This is made possible with specification-based IP insertion, a single, unified database, and Tessent Core Description based data transfer. DFT IP and Signals are automatically configured for all test modes.
By leveraging IEEE 1687 (IJTAG) infrastructure, insertion, ICL extraction, and PDL retargeting is supported for Tessent as well as third-party IP. Multiple chip-level interfaces are supported for manufacturing and in-system test, including IEEE 1149.1, IEEE 1500, and I2C.
With integrated introspection and design editing customizations across the flow, your flow can be customized in a sustainable way. Custom DRCs, user-defined commands, and custom pre- or post-insertion scripts can be utilized across the flow.
Tessent Silicon Lifecycle solutions provide IP and applications that detect, mitigate and eliminate risks throughout the IC lifecycle, from DFT through continuous IC monitoring.
The Siemens Support Center provides you with everything in one easy-to-use location – knowledgebase, product updates, documentation, support cases, license/order information, and more.
Helping you achieve maximum business impact by addressing complex technology and enterprise challenges with a unique blend of development and design experience and methodology expertise.