Tessent Connect

{"showBreadcrumbs":true,"breadcrumbs":[{"title":"Siemens EDA Software","path":"/en-US/"},{"title":"IC Tool Portfolio","path":"/en-US/ic"},{"title":"Silicon Lifecycle Solutions","path":"/en-US/ic/tessent"},{"title":"Tessent Test Solutions","path":"/en-US/ic/tessent/test"},{"title":"Tessent Connect","path":""}],"tagline":"Overview","title":"Tessent Connect","description":"Tessent Connect reduces DFT implementation effort with an optimal automation of the Tessent Shell flow for hierarchical DFT. This addresses the challenges of implementing hierarchical DFT by using intent-driven automation, universal test infrastructure, and future-proof customization.","pricingCurrency":"US$","image":{"url":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/6o5f0aETAiSBpfacO6M7dK/en-US/tessent-connect-offer-imge-640x480.jpg?w=640","alt":"Image showing the three elements of Tessent Connect: intent-driven automation, universal test infrastructure, and future-proof customization","linkData":"{\"name\":\"tessent-connect-offer-imge-640x480\",\"id\":\"6o5f0aETAiSBpfacO6M7dK\",\"contentType\":\"image/jpeg\"}"},"secondaryButton":{"text":"Read Fact Sheet","env":"master","resource":{"ids":["2GVZBTeXIcR7JGxykoFnGB"],"mode":"selected","query":{"q":"connect","sorts":[{"field":"publishedDate","order":"desc"}],"filters":[{"field":"collection","values":["resource"],"operator":"OR"}],"postFilters":[],"verboseLocalization":true},"idsQuery":{"size":1,"filters":[{"field":"collection","values":["resource"],"operator":"OR"},{"field":"id","values":["2GVZBTeXIcR7JGxykoFnGB"],"operator":"OR"}],"verboseLocalization":true}},"locale":"en-US"},"phoneIcon":true,"moreInformation":"Get in touch with our technical team: 1-800-547-3000"}
Overview

Tessent Connect

Tessent Connect reduces DFT implementation effort with an optimal automation of the Tessent Shell flow for hierarchical DFT. This addresses the challenges of implementing hierarchical DFT by using intent-driven automation, universal test infrastructure, and future-proof customization.


Get in touch with our technical team: 1-800-547-3000

Image showing the three elements of Tessent Connect: intent-driven automation, universal test infrastructure, and future-proof customization

Tessent Connect Resources

Key Features

Most Effective DFT Implementation Automation

Tessent Connect helps IC design teams achieve manufacturing test quality goals faster and with fewer resources compared to traditional DFT methods. This production-proven automation enables a simple, consolidated hand-off between teams, resulting in a sustainable and predictable flow.

{"items":[{"title":"Intent-Driven Automation","subtitle":"Faster DFT implementation","description":"<p>With Tessent Connect, you define your intent rather than step-by-step instructions. This is made possible with specification-based IP insertion, a single, unified database, and Tessent Core Description based data transfer. DFT IP and Signals are automatically configured for all test modes. </p>","image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/7GNgIaCfZHdgmrRrsqB8u5/en-US/tessent-feature-51490712-640x480.jpg?w=640&q=60","imageAlt":"Abstract image of an IC on a board | Tessent IC test solutions","imageTitle":"Abstract image of an IC on a board | Tessent IC test solutions","rightIcon":"fal fa-long-arrow-right fa-lg"},{"title":"Universal Test Infrastructure ","subtitle":"Design compatibility","description":"<p>By leveraging IEEE 1687 (IJTAG) infrastructure, insertion, ICL extraction, and PDL retargeting is supported for Tessent as well as third-party IP. Multiple chip-level interfaces are supported for manufacturing and in-system test, including IEEE 1149.1, IEEE 1500, and I2C. </p>","image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/1ARsYKS9h5m4vq9trJGKAA/en-US/tessent-feature-195008932-640x480.jpg?w=640&q=60","imageAlt":"Abstract image showing a cityscape rising from an IC chip | Tessent IC test solutions","imageTitle":"Abstract image showing a cityscape rising from an IC chip | Tessent IC test solutions","rightIcon":"fal fa-long-arrow-right fa-lg"},{"title":"Future-Proof Customization","subtitle":"Flexible use models","description":"<p>With integrated introspection and design editing customizations across the flow, your flow can be customized in a sustainable way. Custom DRCs, user-defined commands, and custom pre- or post-insertion scripts can be utilized across the flow. </p>","image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/78ozP3U13tgS0lz4ky0CBJ/en-US/tessent-features-3-is1210792131-640x480.jpg?w=640&q=60","imageAlt":"abstract image of graphical lines | Root cause deconvolution (RCD) technology in Tessent YieldInsight removes noise from diagnosis results and determines the underlying root causes. ","imageTitle":"abstract image of graphical lines | Root cause deconvolution (RCD) technology in Tessent YieldInsight removes noise from diagnosis results and determines the underlying root causes. ","rightIcon":"fal fa-long-arrow-right fa-lg"}],"env":"master","locale":"en-US"}

Faster DFT implementation

Intent-Driven Automation

<p>With Tessent Connect, you define your intent rather than step-by-step instructions. This is made possible with specification-based IP insertion, a single, unified database, and Tessent Core Description based data transfer. DFT IP and Signals are automatically configured for all test modes. </p>

Abstract image of an IC on a board | Tessent IC test solutions

Design compatibility

Universal Test Infrastructure

<p>By leveraging IEEE 1687 (IJTAG) infrastructure, insertion, ICL extraction, and PDL retargeting is supported for Tessent as well as third-party IP. Multiple chip-level interfaces are supported for manufacturing and in-system test, including IEEE 1149.1, IEEE 1500, and I2C. </p>

Abstract image showing a cityscape rising from an IC chip | Tessent IC test solutions

Flexible use models

Future-Proof Customization

<p>With integrated introspection and design editing customizations across the flow, your flow can be customized in a sustainable way. Custom DRCs, user-defined commands, and custom pre- or post-insertion scripts can be utilized across the flow. </p>

abstract image of graphical lines | Root cause deconvolution (RCD) technology in Tessent YieldInsight removes noise from diagnosis results and determines the underlying root causes.

"eSilicon uses Tessent Connect to help us meet our aggressive production schedules and deliver industry-leading ICs like those based on eSilicon’s neuASIC 7nm platform for machine learning."

Joseph Reynick, Director of DFT services , eSilicon

Ready to learn more about Tessent?

We're standing by to answer your questions.

Tessent Blog

Tessent Silicon Lifecycle solutions provide IP and applications that detect, mitigate and eliminate risks throughout the IC lifecycle, from DFT through continuous IC monitoring.

two squares on top of each other

Support Center

The Siemens Support Center provides you with everything in one easy-to-use location – knowledgebase, product updates, documentation, support cases, license/order information, and more.

EDA Consulting

Helping you achieve maximum business impact by addressing your complex technology and enterprise challenges with a unique blend of development experience, design knowledge, and methodology expertise.