Best of Tessent at International Test Conference
Access the wide range of presentations delivered at the International Test Conference (ITC) by Siemens leaders, Tessent experts, customers and partners. Learn about our industry leading solutions for design for test (DFT), IC test, yield learning and in-life monitoring and analytics.
ITC 2024 - Diamond supporter presentations
Siemens is proud to be a diamond supporter of the International Test Conference 2024. You can watch the recordings of the key diamond presentations below.
Transformative technologies for a sustainable future
Ankur Gupta, Senior Vice President and General Manager of Digital Design Creation Platform at Siemens EDA opens the Diamond Event to speak to the ITC crowd on “Transformative Technologies for a Sustainable Future”
More effective flow enabled by an integrated platform
Anurag Jindal, Head of DFX Group at Ericsson presents on the “Faster and More Effective Flow Enabled by an Integrated Platform”
Test challenges in AI Era
Vishal Agarwal, Senior Director at Nvidia speaks to the ITC 2024 crowd about test challenges in the AI Era
Deterministic in-fleet scan test in AWS cloud
Dan Trock, Principal Engineer at Amazon Web Services, presents on “Deterministic In-fleet Scan Test in AWS Cloud”
ITC 2024 - Partner presentations
Watching presentations in the Tessent theater is a tradition on the ITC exhibit floor, where our customers and partners present their experiences with Tessent technologies, reference flows and collaboration projects. View the most recent presentations from ITC 2024 below.
ITC 2024 - Poster presentations
ITC 2023 recap
Don't miss this opportunity to look back and to learn from Tessent experts DFT presentations over recent years at ITC.
Smart DFT for complex semiconductor designs
Darshan Kobla, Senior Director at Microsoft leading Test Strategy across all product segments, recommends keeping DFT efforts simple and predictable when designs are complex.
Advances in shift-left DFT
Nilanjan Mukherjee, Sr. Director of Engineering, Tessent, Siemens EDA, explains how early DFT verification reduces time to market.
Engineer a smarter future faster
Ankur Gupta, VP/GM, Tessent, Siemens EDA, concludes the ITC Diamond event with a presentation on how Siemens EDA enables a smarter future faster.
ITC 2022 recap
Don't miss this opportunity to look back and to learn from Tessent experts DFT presentations over recent years at ITC.
DFT to in-Life monitoring for electronic systems
Ankur Gupta, Vice President and GM, Tessent, Siemens EDA, introduces DFT to In-Life monitoring for electronic systems at ITC 2022.
Reducing design effort, test time & power with SSN
Dan Trock, Principal Engineer at Amazon Web Services, presents on reducing design effort, test time & power with SSN in AWS Custom Silicon.
Structural deterministic test in silicon lifecycle
Janusz Rajski, Vice President of Research and Development, Tessent, Siemens EDA, presents on structural deterministic test in the silicon lifecycle.
Advancements in DFT automation for 2.5D / 3D IC era
Vidya Neerkundar, Product Manager, Tessent, Siemens EDA introduces Advancements in DFT automation for 2.5D / 3D IC era.
Breakthrough yield barriers - Siemens & PDF Solutions
Breakthrough yield barriers with Siemens & PDF Solutions introduced by Siemens & Thomas Zanon, Engagement Director, PDF Solutions.
ITC 2021 Recap
Don't miss this opportunity to look back and to learn from Tessent experts DFT presentations over recent years at ITC.
SSN implementation on a large multi-die SOC
Dave Dehnert, Principal Engineer, Intel, discusses SSN implementation on a large multi-die SOC.
3D IC test challenges, trends and solutions
Wu Yang, Technical & Foundry Programs Manager for Tessent at Siemens EDA, presents an EDA perspective on 3D IC test, including IEEE 1838 and 3D stack test methodology.
On reduction of deterministic test pattern sets
Janusz Rajski, Vice President of Research and Development for Tessent at Siemens EDA, presents work on the current state of pattern compaction technology.
Security and provisioning through test and safety
Lee Harrison, Automotive Test Solutions Manager for Tessent at Siemens EDA, explores the issues of security challenges in IC test.
Using SLM to monitor automotive electronics
Lee Harrison, Automotive Test Solutions Manager for Tessent at Siemens EDA, discusses using the tools of Silicon Lifecycle Management (SLM) to monitor the aging effects on automotive electronics.
Enhancing test on 3GHz designs with SSN
Srinu Alampally, Master Engineer at Broadcom, presents enhancing test on 3GHz designs with SSN.
Samsung reference flow
Plug & Play DFT solutions to high performance computing (HPC)/AI presented on behalf of Dongkwan Han from Samsung Foundry.