Tessent Events

Visit Tessent at the Siemens EDA booth at DAC 2021, co-located with the RISC-V Summit and SemiCon West.

Watch this webinar on Effectively Addressing the Challenge of Securing Connected and Autonomous Vehicles.

Get a wrap-up of AESIN and watch our video about our Secure-CAV results.

Registrants can revisit Tessent’s talk: Localization of Front-End Defects using Volume Scan Diagnosis, originally presented at the IEEE Int'l Symp. on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2021.

Siemens Fellow Gajinder Panesar presented on optimizing AI chips with Embedded Analytics. The video will soon be available on demand.

Tune in to hear leaders in the field discuss technical challenges in designing AI chips. Gajinder Panesar, Siemens Fellow, talks about the value of Embedded Analytics in helping AI and ML chips reach their potential.

Optimize SoC performance and perform predictive maintenance in the field. A deep data monitoring approach offers radical improvements in time-to-revenue, product quality, reliability and safety, and profitability.

Join this September 23 webinar to learn about reversible scan chain technology and how it improved diagnostic resolution by 4X in an industrial case study.