Tessent answers the critical challenges of today's semiconductor devices with industry-leading technology for design-for-test, operations, and in-life monitoring.
Join this September 23 webinar to learn about reversible scan chain technology and how it improved diagnostic resolution by 3X in an industrial case study.
Join us for a 1 hr webinar on Thursday, 07 October, 2021 at 3:30 PM British Summer Time.
Effectively Addressing the Challenge of Securing Connected and Autonomous Vehicles
Can't make it? Register and watch it on demand.
The webinars listed here were live events but are now available to watch on-demand.
Get a wrap-up of AESIN and watch our video about our Secure-CAV results.
Registrants can revisit Tessent’s talk: Localization of Front-End Defects using Volume Scan Diagnosis, originally presented at the IEEE Int'l Symp. on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2021.
Hybrid live/virtual event
Mountain View, CA
Siemens Fellow Gajinder Panesar presented on optimizing AI chips with Embedded Analytics. The video will soon be available on demand.
AI Hardware Summit Panel Discussion
Tune in to hear leaders in the field discuss technical challenges in designing AI chips. Gajinder Panesar, Siemens Fellow, talks about the value of Embedded Analytics in helping AI and ML chips reach their potential.
Presented by proteanTecs and Siemens
Optimize SoC performance and perform predictive maintenance in the field. A deep data monitoring approach offers radical improvements in time-to-revenue, product quality, reliability and safety, and profitability.
From user success stories to detailed how-to tutorials, these on-demand videos offer insights into the Tessent portfolio of DFT, operations, and Embedded Analytics solutions.