Tessent Events

Dr. Janusz Rajski, Vice President of Engineering at Siemens, opens up VTS 2024 with the keynote presentation on Grand Challenges in Design for Test and Silicon Lifecycle Management.

Come see our Yield Learning and Test experts present on use cases of SmartTest8 SSN.

Discover how embedded software, running on target silicon, can provide a superior alternative to extracting more insights out of on-chip monitors & debug structures for analytics and optimization.

This webinar introduces the Tessent Streaming Scan Network (SSN), a DFT solution which dramatically simplifies and speeds up DFT planning & implementation through automation and plug-&-play methods to deliver fast time to market.

Peter Shields, Product Manager, Tessent, provides an expert insight on the RISC-V trace standard and demonstrates how implementing the standard helps reduce the risks of adopting RISC-V. 

Don't miss this webinar, introducing & demonstrating the new Tessent Multi-die software that delivers comprehensive automation for the highly complex DFT tasks associated with the latest 2.5D and 3D IC designs.

Learn how to rise to the challenges that safety critical ADAS systems introduce to semiconductor designers in meeting functional safety requirements defined by the ISO 26262 standard.

Join this webinar to learn how Tessent SiliconInsight solves the challenges of silicon bring-up for improved yield ramp and time to market.

Watch this on-demand webinar by Siemens and PDF Solutions technologists to learn about our integrated, comprehensive end-to-end solution that includes analytics, scan diagnosis, and machine learning. 

New methods and tools for SoC DFT can simplify the problems introduced by technology, design, and system scaling. Learn how to reduce risk and improve time-to-market with a more predictable and reliable DFT solution. 

Watch this webinar anytime on Effectively Addressing the Challenge of Securing Connected and Autonomous Vehicles.

Tune in to hear leaders in the field discuss technical challenges in designing AI chips. Gajinder Panesar, Siemens Fellow, talks about the value of Embedded Analytics in helping AI and ML chips reach their potential.

Optimize SoC performance and perform predictive maintenance in the field. A deep data monitoring approach offers radical improvements in time-to-revenue, product quality, reliability and safety, and profitability.

Watch this on-demand webinar to learn about reversible scan chain technology and how it improved diagnostic resolution by 4X in an industrial case study.