Xpedition Package Designer

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{"heading":"Xpedition Package Designer","shareURL":"https://eda.sw.siemens.com/en-US/ic-packaging/software/package-designer/features/","children":"<p>Heterogeneous and homogeneous 2.5/3DIC Package physical implementation and manufacturing handoff </p>"}

Xpedition Package Designer

<p>Heterogeneous and homogeneous 2.5/3DIC Package physical implementation and manufacturing handoff </p>
{"items":[{"title":"Advanced Stacking Support for 2.5D/3D Integration","description":"<p>Define and manage complex device stacks such as 3D stacks, side-by-side multiple stacks, and stacks with different heights. Stack implementation using connectivity and proximity checking of pins. Full support for embedded dual-sided die/devices such as interposer/bridge configurations including support for active and passive embedded devices</p>","button":{"text":"Watch Video","url":"https://resources.sw.siemens.com/en-US/technology-overview-hdap-fly-around"},"image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/7bZrQbuRg0wRxDGZ7wWSJo/en-US/advanced-staking-promo-640x480.jpg?w=640&q=60","imageAlt":"advanced-staking-promo","imageTitle":"advanced-staking-promo","rightIcon":"fal fa-long-arrow-right fa-lg"},{"title":"Comprehensive SiP Design Support","description":"<p>Design and verify complex IC packages in a fully supported 3D design environment. Simultaneous 2D/3D edit and DRC all within a single-design tool that easily detects and avoids 3D related design issues. Comprehensive real-time wire bonding for the most complex multi-die/SIP packages with user-definable wire profiles with digital, analog, mixed technology support.</p>","button":{"text":"Read Fact Sheet","url":"https://resources.sw.siemens.com/en-US/fact-sheet-xpedition-package-designer"},"image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/1KtwE5aCiEB15zVOgnGJvC/en-US/sip-design-promo-640x480.jpg?w=640&q=60","imageAlt":"sip-design-promo","imageTitle":"sip-design-promo","rightIcon":"fal fa-long-arrow-right fa-lg"},{"title":"High Performance Signal & Interface Routing","description":"<p>Quickly implement HBM interfaces with automatic step/repeat of channels including automatic compensation for off-pitch pins. Quickly plan and route data paths with patented Sketch automated routing technology. 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Automatic metal balancing with graduated degassing using multiple shapes including automatic dummy metal insertion ensures accurate electrical/thermal modeling.</p>","button":{"text":"Watch Video","url":"https://resources.sw.siemens.com/en-US/technology-overview-multipass-void-generation-in-xpd"},"image":"https://images.sw.cdn.siemens.com/siemens-disw-assets/public/6meu5tpmLnAYO6HZ0tOzDf/en-US/advanced-metal-fill-promo-640x480.jpg?w=640&q=60","imageAlt":"advanced metal fill","imageTitle":"advanced metal fill","rightIcon":"fal fa-long-arrow-right fa-lg"},{"title":"Unique In-design Custom DRC Verification","description":"<p>This verification solution provides extensive and comprehensive capabilities across every level of the package assembly through direct digital integration with Calibre 3DSTACK. 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Advanced Stacking Support for 2.5D/3D Integration

<p>Define and manage complex device stacks such as 3D stacks, side-by-side multiple stacks, and stacks with different heights. Stack implementation using connectivity and proximity checking of pins. Full support for embedded dual-sided die/devices such as interposer/bridge configurations including support for active and passive embedded devices</p>

advanced-staking-promo

Comprehensive SiP Design Support

<p>Design and verify complex IC packages in a fully supported 3D design environment. Simultaneous 2D/3D edit and DRC all within a single-design tool that easily detects and avoids 3D related design issues. Comprehensive real-time wire bonding for the most complex multi-die/SIP packages with user-definable wire profiles with digital, analog, mixed technology support.</p>

sip-design-promo

High Performance Signal & Interface Routing

<p>Quickly implement HBM interfaces with automatic step/repeat of channels including automatic compensation for off-pitch pins. Quickly plan and route data paths with patented Sketch automated routing technology. Built-in automatic SI performance net tuning with automatic shielding of differential pairs and single-ended nets.</p>

high-perf-routing-promo

Reduce Cycle-time Through Designer Efficiency

<p>Rapid prototyping with layout-driven-design enabling a start-from-nothing methodology with on-the-fly device and net creation. Supports rapid evaluation of design feasibility enabling predictive electrical/thermal modeling. Real-time concurrent team design enables multiple designers to simultaneously work on the same design with real-time visualization of all users&#39; design activity.</p>

Reduce Cycle Time Image

Advanced Metal Fill That Meets Fabrication Requirements

<p>Powerful metal shape processing that is correct-by-construction. Add and manage throughout the design process without impacting performance. Automatic metal balancing with graduated degassing using multiple shapes including automatic dummy metal insertion ensures accurate electrical/thermal modeling.</p>

advanced metal fill

Unique In-design Custom DRC Verification

<p>This verification solution provides extensive and comprehensive capabilities across every level of the package assembly through direct digital integration with Calibre 3DSTACK. By using the actual planned manufacturing data, as opposed to the design tools native database, you ensure that post-processing errors are not introduced.</p>

drc verification Image

Comprehensive 3D Package Signoff with Calibre

<p>Provides extensive and comprehensive signoff verification across every level of the package assembly through direct digital integration with Calibre 3DSTACK. Independently verify the manufacturing outputs, not just the design database. Supports dynamic cross-probing to quickly identify and resolve issues ensuring the design matches manufacturing outputs.</p>

3D_Package_Signoff Image