Integrated Fanout (InFO)
Supports single, multi-die, or package-on-package. Complete prototyping, design and verification certified.
Chip on Wafer on Substrate (CoWoS)
Integrates logic and memory in 3D targeting, AI, and HPC. Innovator3D IC creates, optimizes & manages a 3D model of the entire CoWoS device assembly.
Wafer on Wafer (WoW)
Innovator3D IC creates, optimizes, and manages a 3D digital twin model that drives detailed design and verification.
System-on-Integrated-Chips (SoIC)
Innovator3D IC optimizes and manages a 3D digital twin model that drives design and then verification with Calibre technologies.