Efficient, full-package model creation well-suited for complete-system SPICE model generation and accounting for skin effect impact on resistance and inductance.
Accelerated, full-3D electro-magnetic-quasi-static (EMQS) extractor.
High capacity quasistatic solver and hybrid/multi-core support combine for fast, full-package extraction while capturing all 3D effects.
Extract simulation models of your complex packages for downstream customer use or perform fast analysis of combined chip-package-board design parasitics.