Using specialized data mining and statistical analysis techniques, the product eliminates noise from diagnosis data to determine the underlying root causes, identify systematic yield limiters, and select the best devices for failure analysis.
Tessent YieldInsight identifies the cause of systematic yield loss and provides guidance through
the process of selecting die for failure analysis.
Root cause deconvolution (RCD) technology in Tessent YieldInsight removes noise from diagnosis
results and determines the underlying root causes. It selects and filters populations of failing die, grouping die that are failing for similar reasons, and analyzing various aspects of these populations to identify and locate systematic yield loss mechanisms.
Tessent YieldInsight statistically analyzes the layout-aware and cell-aware diagnosis results from Tessent Diagnosis to identify and separate systematic yield limiters before any failure analysis is done. This eliminates the need for costly physical localization and reduces the time to determining root cause of yield loss from weeks to days.
Tessent Silicon Lifecycle solutions provide IP and applications that detect, mitigate and eliminate risks throughout the IC lifecycle, from DFT through continuous IC monitoring.
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