Using specialized data mining and statistical analysis techniques, Tessent YieldInsight eliminates noise from diagnosis data to determine the underlying root causes, identify systematic yield limiters and select the best devices for failure analysis.
Tessent YieldInsight identifies the cause of systematic yield loss and provides guidance through the process of selecting die for failure analysis.
Root cause deconvolution (RCD) technology removes noise from diagnosis results and determines the underlying root causes. It selects and filters populations of failing die, grouping die that are failing for similar reasons.
Analyzes the layout-aware and cell-aware diagnosis results from Tessent Diagnosis to identify and separate systematic yield limiters before any failure analysis is done, eliminating the need for costly physical localization.
Hosted by ASM International, this joint webinar between Siemens EDA and Qualcomm spotlights: