CUT YOUR DESIGN TIMES BY 30%
Trade up to Xpedition Package Designer
Your competition is completing package designs 30% faster—they traded up to Xpedition Package Designer. xPD is designed for the physical design, verification, and modeling of emerging High Density Advanced Packaging (HDAP) technologies. Read more below or talk to an expert today.
Six key differentiators of xPD
xPD software is designed for the physical design, verification and modeling of emerging high-density advanced packaging (HDAP) technologies. In the following six videos we break down the key features that set xPD apart from the competition.
IC packaging for physical design and verification
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IC packaging for physical design and verification
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Dynamic mask-ready hatched metal fill
(2 mins, 34 secs)
Degassing void control under diff-pairs
(1 min, 28 secs)
Visual guide for manual void degassing void insertion
(2 mins, 32 secs)
Graduated multi-pass out gassing
(2 mins, 46 secs)
Offset hatched planes
(1 min, 6 secs)
Predictable PDN stability
(3 mins, 34 secs)
Pushing the system-in-package concept into the future
"We selected Siemens as they demonstrated their technologies’ capability and capacity, along with their expertise in advanced heterogeneous semiconductor package design."
-Bryan Black, CEO Chipletz
