{"showBreadcrumbs":true,"breadcrumbs":[{"title":"Siemens EDA Software","path":"/en-US/"},{"title":"IC Packaging","path":"/en-US/ic-packaging"},{"title":"IC Packaging Solutions","path":"/en-US/ic-packaging/software"},{"title":"Package Signoff","path":""}],"tagline":"Overview","title":"Package Signoff","description":"Design verification of multiple die and substrate assemblies by identifying geometries per layer per die placement in the assembly. DRC and LVS is performed on the interface geometries between die with support for dies from multiple processes.","pricingCurrency":"US$","image":{"url":"//images.ctfassets.net/17si5cpawjzf/3CpoXAKHFGU5HtK2JMZeg1/d9128d37be9c7ad15363f229ba67a4f0/calibre-3dstack-new-promo-640x480.jpg?w=640","alt":"calibre 3dstack new promo","linkData":"{\"name\":\"calibre-3dstack-new-promo-640x480\",\"id\":\"3CpoXAKHFGU5HtK2JMZeg1\",\"contentType\":\"image/jpeg\"}"},"secondaryButton":{"text":"Read White Paper","url":"https://resources.sw.siemens.com/en-US/white-paper-crossing-the-chasm-bringing-soc-and-package-verification-together-with","env":"master"}}
Overview

Package Signoff

Design verification of multiple die and substrate assemblies by identifying geometries per layer per die placement in the assembly. DRC and LVS is performed on the interface geometries between die with support for dies from multiple processes.

calibre 3dstack new promo
Key Features

Foundry/OSAT Driven Substrate Verification

When performance and time-to-market control potential profitability, using Calibre nmDRC for your physical verification enables success. Continually evolving to meet the demands of shrinking geometries and complex manufacturing methodologies, Calibre rule decks are proven long before you need them.

Signoff Verification of 2.5/3D Stacked Die Assemblies

Provides complete design verification of stacked die assemblies and delivers 3D assembly LVS for assemblies such as stacked memories, stacked sensor arrays, interposer-based structures, and package-level RDL routing (wafer-level packaging). Errors and issues are cross-probed directly into the design for immediate attention.

sign off

Ready to talk to someone today?

We're standing by to answer your questions.

Email us

Get in touch with our sales team 1-800-547-3000 or 1-503-685-8000

image of arrows

Join the IC Design Community

Join the discussion on new topics, features, content, and technical experts.

two squares on top of each other

Catapult Support

Access detailed documentation, on-demand training resources and more.

EDA Consulting

Helping you achieve maximum business impact by addressing your complex technology and enterprise challenges with a unique blend of development experience, design knowledge, and methodology expertise.

{"desc":"This site uses cookies in order to improve your user experience and to provide content tailored specifically to your interests. Detailed information on the use of cookies on this website is provided in our Privacy Policy. You can also manage your preferences there. By using this website, you consent to the use of cookies.","learnMoreText":"Learn More","learnMoreUrl":"https://new.siemens.com/global/en/general/cookie-notice.html","okText":"OK"}