What’s new in Semiconductor Packaging 2409​

This release delivers a next generation solution for heterogeneous integration prototyping and floorplanning of advanced 2.5/3D package assemblies, Innovator3D IC. It also features a new modern user experience for Xpedition Package Designer as well as many new enhanced capabilities.​

new capabilities

Innovator3D IC 2409 Update 3

The release 2409 Update 3 contains considerable new capabilities and enhancements to existing functionality such as automated UBM array creation for interposers, automatic creation of a package layout during snapshot import and more, find out all the details by downloading the factsheet.

New modern user experience

The 2409 update removes the barriers of design complexity by delivering an adaptive and agile user experience that lowers learning curves and enables the fastest time-to-productivity. By prioritizing ease-of-use and unified UX, engineers can work more efficiently, accelerate results and increase their satisfaction. Preview the new user experience in Xpedition.

Woman at a computer using IC Packaging's new software update with a modern GUI and UX.

Innovator3D IC

Innovator3D IC is a cockpit for 2.5/3D heterogenous integration of semiconductors.

A screen shot of the Innovator3D IC canvas

What's new in Xpedition Package Designer 2409

Take a deeper dive into the new features for Xpedition Package Designer in the 2409 release.

Download the release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the release highlights on Support Center for detailed information regarding all new features and enhancements.