What’s new in Semiconductor Packaging 2409​

This release delivers a next generation solution for heterogeneous integration prototyping and floorplanning of advanced 2.5/3D package assemblies, Innovator3D IC. It also features a new modern user experience for Xpedition Package Designer as well as many new enhanced capabilities.​

New modern user experience

The 2409 update removes the barriers of design complexity by delivering an adaptive and agile user experience that lowers learning curves and enables the fastest time-to-productivity. By prioritizing ease-of-use and unified UX, engineers can work more efficiently, accelerate results and increase their satisfaction. Preview the new user experience in Xpedition.

Woman at a computer using IC Packaging's new software update with a modern GUI and UX.

Innovator3D IC

Innovator3D IC is a cockpit for 2.5/3D heterogenous integration of semiconductors.

A screen shot of the Innovator3D IC canvas

What's new in Xpedition Package Designer 2409

Take a deeper dive into the new features for Xpedition Package Designer in the 2409 release.

Download the release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the release highlights on Support Center for detailed information regarding all new features and enhancements.