What's new
Product release highlights for IC Packaging VX.2.12
Xpedition IC Packaging VX.2.12 delivers capabilities targeting heterogeneous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.12 release.
Watch the overview video
Watch some of the new capabilities in this short video.
What's new in IC Packaging VX.2.12
Watch narrated videos of selected new capabilities.
IC Packaging VX.2.12 videos
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IC Packaging VX.2.12 videos
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Display and edit component properties in property editor
(2 mins, 2 secs)
GUI for adding pins and IOcells
(2 mins, 9 secs)
Import bitmaps into “views” for guidance driven floorplanning
(1 min, 32 secs)
XPD Tapered Transitions
(1 min, 37 secs)
XPD Via stitching
(1 min, 23 secs)
Xpedition IC Packaging VX.2.12 fact sheet
Learn about the key capabilities in the Xpedition IC Packaging VX.2.12 release in this fact sheet.
Download the release
Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.
Explore what we have introduced in past releases
VX.2.11 release of HyperLynx delivers state-of-the-art simulation capabilities to mainstream designers by combining advanced modeling and simulation techniques with automated workflows that guide users through analysis step by step.
See what you missed in IC Packaging VX.2.11
Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.11 release.
