What's new

Product release highlights for IC Packaging VX.2.12

Xpedition IC Packaging VX.2.12 delivers capabilities targeting heterogeneous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.12 release.

Watch the overview video

Watch some of the new capabilities in this short video.

Fact sheet

Xpedition IC Packaging VX.2.12 fact sheet

Learn about the key capabilities in the Xpedition IC Packaging VX.2.12 release in this fact sheet.

Download the release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.

Previous releases

Explore what we have introduced in past releases

VX.2.11 release of HyperLynx delivers state-of-the-art simulation capabilities to mainstream designers by combining advanced modeling and simulation techniques with automated workflows that guide users through analysis step by step.

See what you missed in IC Packaging VX.2.11

Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.11 release.

What's New in IC Packaging VX.2.11

See what you missed in IC Packaging VX.2.10

Visit support center.

What's new in Xpedition IC Packaging VX.2.10 Update 3