What’s New in Xpedition IC Packaging-VX.2.11

Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.11 release.

Watch the Overview Video

Watch some of the new capabilities in this short video.

What's New in IC Packaging VX.2.11

Watch narrated videos of selected new capabilities.

Rapid creation and planning of ultra-high pin count devices

IC Packaging VX.2.11 Videos

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Rapid creation and planning of ultra-high pin count devices

(1 min, 37 secs)


Cross-substrate system-level predictive SI/PI analysis during planning

(1 min, 2 secs)


Fast, accurate and optimized floorplan creation

(1 min, 32 secs)


Hierarchical Device Planning: Create device from Floorplan ​VX.2.11

(1 min, 20 secs)


Data Path Planning in XSI ​-VX.2.11

(1 min, 4 secs)


System Verilog integration-VX.2.11

(59 secs)


50M+ pin design support

(1 min, 11 secs)


Via stitching of phase tuned diff pairs

(1 min, 13 secs)


Outgassing rules to adjacent layer voids

(1 min, 19 secs)

Download the Release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.

See what you missed in IC Packaging VX.2.10

Visit support center.

What's new in Xpedition IC Packaging VX.2.10 Update 3