What’s New in Xpedition IC Packaging-VX.2.11

Xpedition IC Packaging VX.2.11 delivers capabilities targeting heterogenous integration and the prototyping, planning, design and verification of next-generation 2.5/3D package assemblies. Discover the new features and capabilities of the VX.2.11 release.

Watch the Overview Video

Watch some of the new capabilities in this short video.

Download the Release

Note: The following is a condensed summary of the release highlights. Siemens customers should refer to the Release Highlights on Support Center for detailed information regarding all new features and enhancements.


Explore What we Have Introduced in Past Releases

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What's new in Xpedition IC Packaging VX.2.10 Update 3