Unified cockpit for heterogeneous integration

Plan and design complex systems with unparalleled efficiency by leveraging a full-system perspective which is critical for 2.5/3D heterogeneous integration.

Utilize innovative hierarchical device planning capabilities to scale intricate designs and quickly implement critical updates, ultimately producing well-qualified designs ready for implementation.

Conduct system-level predictive multi-physics analysis to thoroughly evaluate design scenarios before physical implementation. Run detailed warpage-related metal density analysis and achieve sub-nanometer resolution for direct/hybrid bonding, ensuring the highest precision in your designs.

Gain critical insights into power, signal, thermal, and mechanical stress with Calibre, HyperLynx and Simcenter to optimize and verify your designs comprehensively and mitigate potential issues early in the design cycle.

Aggregate chiplets, discretes and substrates into a cohesive connectivity planning environment and facilitate collaboration across geographies and departments.

Guarantee broad ecosystem compatibility by fully supporting critical industry standards. Utilize comprehensive 3Dblox read, write, author, and edit capabilities, alongside support for UCIe and BoW, to enable seamless interoperability and the rapid adoption of new die-to-die interface IP

Accelerate your design cycles with an AI-infused 3D user experience that provides intuitive interactions. Design and verify efficiently using specialized features like daisy-chain test vehicle design, enabling rapid validation and
reducing turnaround times.

Think of it as smart assistance that anticipates your needs, streamlines complex tasks, and provides intelligent suggestions, allowing you to work faster and with fewer errors.

Innovator3D IC Integrator use its digital twin to drive ASIC, Chiplet and Interposer implementation using Aprisa and Xpedition Package Designer, Calibre multi-physics analysis, NX mechanical design, Tessent test, Calibre signoff and release to fabrication and manufacturing through a managed and secure design IP digital thread conduit.

Innovator3D IC Integrator will be available in 2 configurations, one targeting those companies/designers who do not undertake any form of ASIC/chiplet bump-planning or co-design. The other targeting those companies/designers who do undertake ASIC/chiplet bump-planning and co-design with the semiconductor P&R designers.

Siemens provides open technology, we recognize that many companies may have non-Siemens tools and we openly integrate with those.

Innovator3D IC Integrator supports the import and export of 3Dblox files along with 3D visualization of what was imported.

Innovator3D IC Integrator leverages machine learning (ML) and artificial intelligence (AI) in multiple areas. For example, when assigning the system-level logical netlist between multiple die, or chiplets, Innovator3D IC Integrator uses unique machine learning algorithms to optimize the netlist across all the levels of the design hierarchy concurrently.