High Bandwidth Memory (HBM) integration in IC package design refers to the incorporation of HBM technology within the packaging of the IC. This involves designing the package to accommodate HBM memory modules, which are stacked vertically on the IC die.
High bandwidth memory (HBM) integration results in substantially smaller form factors than DDR.
HBM offers improved performance compared to traditional memory technologies like DDR (Double Data Rate) and SDRAM.
High Bandwidth Memory's exceptional energy efficiency makes it the go-to choice for a wide range of applications.
Learn more about efficient high bandwidth memory (HBM) integration capabilities provided with Xpedition Package Designer for IC packaging design. Specifically you will see a demo of our patented "sketch" router technology.
In this short 1-minute video you will see a demonstration of Xpedition Package Designers patented “sketch” router being used on a high bandwidth memory (HBM) memory interface. This is just one way that our software supports High Bandwidth Memory integration.