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Multi-Discipline Systems Engineering

Xpedition delivers integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.

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Digital Thread

Enable a digital thread from requirements through manufacturing, across multiple disciplines to minimize rework and improve product quality.

A microprocessor attached to a curcuit board.
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Multi-Board Design

Improve team efficiency with an automated workflow for multi-board system definition, partitioning and integration of individual board designs.

3D graphic of a computer motherboard
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ECAD/MCAD co-design

Collaborate efficiently between ECAD and MCAD domains to optimize electronics within tight form-factor constraints while still meeting quality, reliability and performance requirements.

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FPGA/PCB co-design

Eliminate the barriers between FPGA and PCB design organizations, enabling concurrent design processes with greater accuracy and speed. Optimize the FPGA I/O in the context of the PCB layout.

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IC Packaging/PCB Co-Design

Address high density advanced package (HDAP) rapid prototyping assembly, physical design, verification, signoff and modeling — co-designed in context with the ICs and PCBs in the electronics system.

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A/D/RF Co-Design

Concurrently design RF circuits in the context of the entire PCB, ensuring optimal density and minimal interference. Dynamically integrate with industry RF simulation tools to reduce design cycles.