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Multi-Discipline Systems Engineering

Xpedition delivers integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.

Digital Thread

Enable a digital thread from requirements through manufacturing, across multiple disciplines to minimize rework and improve product quality.

{"desc":"This site uses cookies in order to improve your user experience and to provide content tailored specifically to your interests. Detailed information on the use of cookies on this website is provided in our Privacy Policy. You can also manage your preferences there. By using this website, you consent to the use of cookies.","learnMoreText":"Learn More","learnMoreUrl":"https://new.siemens.com/global/en/general/cookie-notice.html","okText":"OK"}