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Multi-Discipline Systems Engineering

Xpedition delivers integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA and MCAD to ensure teams have the flexibility and intuitive technologies they need.

{"items":[{"title":"Digital Thread","description":"<p>Enable a digital thread from requirements through manufacturing, across multiple disciplines to minimize rework and improve product quality.</p>","image":"https://images.sw.siemens-cdn.com/siemens-disw-assets/public/3C7I5pdohaQ2cdNdMSb6nE/en-US/Stock5-640x480.png?w=640&q=60","rightIcon":"fal fa-long-arrow-right fa-lg"}],"env":"master"}

Digital Thread

<p>Enable a digital thread from requirements through manufacturing, across multiple disciplines to minimize rework and improve product quality.</p>