Get the inside track on our upcoming conferences, seminars, and webinars covering in-depth topics around our Systems PCB design flow, scalable high-speed system design & verification and semiconductor packaging.
We will showcase our advanced HyperLynx technologies for electrical sign-off, including a complete analysis environment for SerDes Channel compliance, DDRx designs, full-wave 3D electromagnetic modeling, DRC, and power integrity.
Exhibition: Jan. 30 – Feb. 1, 2024
Santa Clara, CA
Attend one of our EDA technical sessions and stop by our booth to learn more about Xpedition IC Packaging design.
Conference: March 18 – 21, 2024
Fountain Hills, AZ