Get the inside track on our upcoming conferences, seminars, and webinars covering in-depth topics around our Systems PCB design flow, scalable high-speed system design & verification and semiconductor packaging.
Xpedition IC Packaging Design
Attend one our EDA technical sessions to learn more about Xpedition IC Packaging design. We will be showcasing and discussing our comprehensive solutions and workflows for 2.5/3D heterogeneous semiconductor packaging integration.
March 13 -16, 2023
Fountain Hills, AZ
Siemens is driving transformation to enable a digital enterprise for electronic systems. We will be showcasing and discussing our comprehensive solutions and workflows for 2.5/3D heterogeneous semiconductor packaging integration.
March 20-23, 2023
San Diego, CA
Join us for the Siemens EDA Forum Hsinchu 2023 focused on EDA tools auto IC, complex SOC, advanced node and 3D IC.
March 30th, 2023
Hsinchu, Taiwan