Get the inside track on our upcoming conferences, seminars, and webinars covering in-depth topics around our Systems PCB design flow, scalable high-speed system design & verification and semiconductor packaging.
Location: Johns Hopkins University
User2User is your opportunity to learn, grow and connect with fellow technical experts who design leading-edge products using Siemens EDA tools.
Conference: September 18, 2024
Location: Everett, MA
Join us at IMAPS 2024 in Boston, MA for 3 days of microelectronics and advanced packaging technical content.
Conference: October 1-3, 2024
Exhibition: October 1-2. 2024
Location: Santa Clara, CA
Attend one of our EDA technical sessions and stop by our booth to learn more about Xpedition, Hyperlynx and Valor tools.
Conference: October 8-11, 2024
Exhibition: October 9, 2024
Location: Raleigh, NC
Stop by our booth and learn about Xpedition, Hyperlynx & Valor tools.
Conference: November 13, 2024
Location: Munich, Germany
Stop by our booth and learn about Xpedition, Hyperlynx and Valor tools.
Conference: November 12-15, 2024
Location: Santa Clara Convention Center
This unique event gives attendees a place to network with peers, ask questions of the experts, and talk to vendors offering a wide variety of products and services.
Conference & exhibition: Jan. 21-23
We will showcase our advanced HyperLynx technologies for electrical sign-off, including a complete analysis environment for SerDes Channel compliance, DDRx designs, full-wave 3D electromagnetic modeling, DRC, and power integrity.
Conference: January 28-30
Exhibition: January 29-30
Location: Sheraton Grand Phoenix, AZ
Attend one of our EDA technical sessions and stop by our booth to learn more about Xpedition IC Packaging design.
Conference: March 3-6, 2025