Upcoming events
DesignCon 2025
January 29-30 | Santa Clara, CA
Santa Clara Convention Center
Siemens Booth #1049
Santa Clara Convention Center - Jan. 29th-30th, 2025
Join our high-speed design experts at DesignCon 2025 to get a tour of our latest analysis solutions from the HyperLynx family of products. From small scale to large state-of-the-art designs, we look forward to discussing your projects and exploring how we can simplify and streamline your analysis.
Automated progressive verification
Your time is money. That is why HyperLynx helps you to maximize your design quality with minimal effort by optimizing the design verification process itself. Catching errors early in the design process is critical to completing projects on time. Relying on experts to perform post-route analysis creates a bottleneck in your design analysis stage. Discover how PCB designers can leverage the intuitive nature of HyperLynx to perform the majority of your analysis, leaving the Signal Integrity experts to perform in detail.
Hyperscaler design & verification
We provide complete end-to-end solutions for Hyperscaler high-speed design and verification, allowing you to effortlessly scale your design coverage while increasing the accuracy of your overall design. HyperLynx's SerDes SI simulation provides in-depth solutions.
3D IC design & verification
We continue to expand our comprehensive semiconductor packaging offerings with the recent launch of Innovator3D IC. Innovator3D IC provides an integrated cockpit that allows for a single, unified data model for design planning, prototyping and predictive analysis of the complete semiconductor package assembly. It is focused on enabling architectural and technology trade-offs to achieve high-performance, cost-effective solutions in the fastest, most efficient way possible.