Multi-Discipline Systems Engineering
Modern electronics design requires a seamless environment with a tightly integrated multi-discipline engineering environment. Remaining competitive requires industry-leading technologies for collaboration and co-design between IC packaging, multi-board design, RF, harness, FPGA, and MCAD teams.
Multi-Discipline Systems Engineering
Xpedition delivers integrated, collaborative, co-design systems connecting IC packaging, multi-board, RF, harness, FPGA, and MCAD domains to ensure teams have the flexibility and intuitive technologies they need.
