Extending physical verification from the IC world to the advanced packaging world to improve multi-die package manufacturability. Use one Calibre cockpit for assembly-level DRC, LVS, and PEX without disruption to traditional packaging formats and tools.
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The Calibre 3DSTACK tool extends Calibre die-level signoff verification to complete signoff verification of a wide range of 2.5D and 3D stacked die designs. Designers can run signoff DRC and LVS checking of complete multi-die systems at any process node using existing tool flows and data formats.
<p>The Calibre 3DSTACK tool enables designers to check for accurate alignment between different die in a multi-die package assembly.</p>
<p>The Calibre 3DSTACK tool supports system-level connectivity checking for the multi-die package assembly, allowing designers to verify that dies, interposers and packages are connected as intended.</p>
<p>The Calibre 3DSTACK tool enables designers to check standalone interposer/package connectivity without including the individual die design databases.</p>
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Across all process nodes and design styles, the Calibre toolsuite delivers accurate, efficient, comprehensive IC verification and optimization, while minimizing resource usage and tapeout schedules.