Overview

Calibre 3DSTACK

Extending physical verification from the IC world to the advanced packaging world to improve multi-die package manufacturability. Use one Calibre cockpit for assembly-level DRC, LVS, and PEX without disruption to traditional packaging formats and tools.


Get in touch with our technical team: 1-800-547-3000

Stylized board circuitry | The Calibre 3DSTACK tool extends physical verification from the IC world to the 2.5/3D IC packaging world to improve multi-die package manufacturability.
Key Features

Multi-Die, System-Level Alignment/Connectivity Checks

The Calibre 3DSTACK tool extends Calibre die-level signoff verification to complete signoff verification of a wide range of 2.5D and 3D stacked die designs. Designers can run signoff DRC and LVS checking of complete multi-die systems at any process node using existing tool flows and data formats.

Accurate Alignment

Multi-Die/Die-on-Package/Interposer Alignment Checks

The Calibre 3DSTACK tool enables designers to check for accurate alignment between different die in a multi-die package assembly.

glowing IC chip with currents flowing into it | The Calibre 3DSTACK tool enables designers to check for accurate alignment between different die in a multi-die package assembly.
System-Level Connectivity

Multi-Die, System-Level Connectivity Checking

The Calibre 3DSTACK tool supports system-level connectivity checking for the multi-die package assembly, allowing designers to verify that dies, interposers and packages are connected as intended.

Stylized aerial shot of electronic board | The Calibre 3DSTACK tool supports system-level connectivity checking for the multi-die package assembly, allowing designers to verify that dies, interposers and packages are connected as intended.
Standalone Checking

Interposer/Package Connectivity Checking

The Calibre 3DSTACK tool enables designers to check standalone interposer/package connectivity without including the individual die design databases.

Stylized IC circuitry with moving signals | The Calibre 3DSTACK tool enables designers to check standalone interposer/package connectivity without including the individual die design databases.

Calibre 3DSTACK Featured Resources

Explore our featured resources or visit the full Calibre 3DSTACK resource library to view on-demand webinars, white papers, and fact sheets.

Ready to learn more about Calibre?

We're standing by to answer your questions! Get in touch with our team today:

Call: 1-800-547-3000

Send an email

Calibre consulting services

We help you adopt, deploy, customize and optimize your complex design environments. Direct access to engineering and product development lets us tap into deep domain and subject matter expertise.

Support center

The Siemens Support Center provides you with everything in one easy-to-use location -
knowledgebase, product updates, documentation, support cases, license/order information and more.

Design with Calibre blog

Across all process nodes and design styles, the Calibre tool suite delivers accurate, efficient, comprehensive IC verification and optimization, while minimizing resource usage and tapeout schedules.

High density advanced packaging (HDAP) product trials

Explore the differentiated capabilities of the Xpedition and Calibre technologies in these self-contained cloud-hosted virtual laboratories.