Calibre 3DSTACK

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Overview

Calibre 3DSTACK

Extending physical verification from the IC world to the advanced packaging world to improve multi-die package manufacturability. Use one Calibre cockpit for assembly-level DRC, LVS, and PEX without disruption to traditional packaging formats and tools.


Get in touch with our technical team: 1-800-547-3000

Stylized board circuitry | The Calibre 3DSTACK tool extends physical verification from the IC world to the 2.5/3D IC packaging world to improve multi-die package manufacturability.

Calibre 3DSTACK Resources

Key Features

Multi-Die, System-Level Alignment/Connectivity Checks

The Calibre 3DSTACK tool extends Calibre die-level signoff verification to complete signoff verification of a wide range of 2.5D and 3D stacked die designs. Designers can run signoff DRC and LVS checking of complete multi-die systems at any process node using existing tool flows and data formats.

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Accurate Alignment

Multi-Die/Die-on-Package/Interposer Alignment Checks

<p>The Calibre 3DSTACK tool enables designers to check for accurate alignment between different die in a multi-die package assembly.</p>

glowing IC chip with currents flowing into it | The Calibre 3DSTACK tool enables designers to check for accurate alignment between different die in a multi-die package assembly.

System-Level Connectivity

Multi-Die, System-Level Connectivity Checking

<p>The Calibre 3DSTACK tool supports system-level connectivity checking for the multi-die package assembly, allowing designers to verify that dies, interposers and packages are connected as intended.</p>

Stylized aerial shot of electronic board | The Calibre 3DSTACK tool supports system-level connectivity checking for the multi-die package assembly, allowing designers to verify that dies, interposers and packages are connected as intended.

Standalone Checking

Interposer/Package Connectivity Checking

<p>The Calibre 3DSTACK tool enables designers to check standalone interposer/package connectivity without including the individual die design databases.</p>

Stylized IC circuitry with moving signals | The Calibre 3DSTACK tool enables designers to check standalone interposer/package connectivity without including the individual die design databases.

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